Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12234383 | Low dishing oxide CMP polishing compositions for shallow trench isolation applications and methods of making thereof | Xiaobo Shi, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2025-02-25 |
| 12205061 | Shared data induced quality control for a chemical mechanical planarization process | Cesar Clavero, Vid Gopal, Ryan W. Clarke, Esmeralda Yitamben, Hieu Pham +6 more | 2025-01-21 |
| 12091581 | High oxide film removal rate shallow trench (STI) chemical mechanical planarization (CMP) polishing | Xiaobo Shi, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2024-09-17 |
| 11692110 | Low oxide trench dishing chemical mechanical polishing | Xiaobo Shi, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2023-07-04 |
| 11667839 | Low oxide trench dishing chemical mechanical polishing | Xiaobo Shi, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2023-06-06 |
| 11608451 | Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with tunable silicon oxide and silicon nitride removal rates | Xiaobo Shi, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2023-03-21 |
| 11549034 | Oxide chemical mechanical planarization (CMP) polishing compositions | Xiaobo Shi, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2023-01-10 |
| 11326076 | Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with low abrasive concentration and a combination of chemical additives | Xiaobo Shi, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2022-05-10 |
| 11254839 | Low oxide trench dishing shallow trench isolation chemical mechanical planarization polishing | Xiaobo Shi, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2022-02-22 |
| 11180678 | Suppressing SiN removal rates and reducing oxide trench dishing for Shallow Trench Isolation (STI) process | Xiaobo Shi, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2021-11-23 |
| 11111415 | Chemical mechanical planarization of films comprising elemental silicon | James M. Henry, Hongjun Zhou, Dnyanesh Chandrakant Tamboli, Joseph D. Rose | 2021-09-07 |
| 11078417 | Low oxide trench dishing chemical mechanical polishing | Xiaobo Shi, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2021-08-03 |
| 11072726 | Low oxide trench dishing chemical mechanical polishing | Xiaobo Shi, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2021-07-27 |
| 10894906 | Composite particles, method of refining and use thereof | Hongjun Zhou, John Edward Quincy Hughes, Reinaldo Mario Machado, Mark Leonard O'Neill, Dnyanesh Chandrakant Tamboli | 2021-01-19 |
| 10669449 | Composite abrasive particles for chemical mechanical planarization composition and method of use thereof | Hongjun Zhou, Jo-Ann Theresa Schwartz, Malcolm Grief, Xiaobo Shi, Steven Charles Winchester +5 more | 2020-06-02 |
| 10421890 | Composite particles, method of refining and use thereof | Hongjun Zhou, John Edward Quincy Hughes, Reinaldo Mario Machado, Mark Leonard O'Neill, Dnyanesh Chandrakant Tamboli | 2019-09-24 |
| 10418247 | Composite abrasive particles for chemical mechanical planarization composition and method of use thereof | Hongjun Zhou, Dnyanesh Chandrakant Tamboli | 2019-09-17 |
| 10109493 | Composite abrasive particles for chemical mechanical planarization composition and method of use thereof | Hongjun Zhou, Jo-Ann Theresa Schwartz, Malcolm Grief, Xiaobo Shi, Steven Charles Winchester +5 more | 2018-10-23 |
| 9305806 | Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications | Xiaobo Shi, James Allen Schlueter, Jae-ouk Choo | 2016-04-05 |
| 8974692 | Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications | Xiaobo Shi, James Allen Schlueter, Jae-ouk Choo | 2015-03-10 |
| 6555466 | Two-step chemical-mechanical planarization for damascene structures on semiconductor wafers | Thomas Laursen, Malcolm Grief, Sanjay Basak | 2003-04-29 |
| 6387188 | Pad conditioning for copper-based semiconductor wafers | Thomas Laursen, Malcolm Grief, Sanjay Basak | 2002-05-14 |