Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11066575 | Chemical mechanical planarization for tungsten-containing substrates | Xiaobo Shi, Hongjun Zhou, Jo-Ann Theresa Schwartz | 2021-07-20 |
| 10745589 | Chemical mechanical polishing (CMP) of cobalt-containing substrate | Xiaobo Shi, Joseph D. Rose, Timothy Joseph Clore, Malcolm Grief, Mark Leonard O'Neill | 2020-08-18 |
| 10217645 | Chemical mechanical polishing (CMP) of cobalt-containing substrate | Xiaobo Shi, Mark Leonard O'Neill | 2019-02-26 |
| 10032644 | Barrier chemical mechanical planarization slurries using ceria-coated silica abrasives | Xiaobo Shi, Mark Leonard O'Neill, Dnyanesh Chandrakant Tamboli | 2018-07-24 |
| 10011741 | Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof | Xiaobo Shi, John Edward Quincy Hughes, Hongjun Zhou, Daniel Hernandez Castillo, II, Jae-ouk Choo +6 more | 2018-07-03 |
| 9978609 | Low dishing copper chemical mechanical planarization | Xiaobo Shi, Joseph D. Rose, Mark Leonard O'Neill, Malcolm Grief | 2018-05-22 |
| 9574110 | Barrier chemical mechanical planarization composition and method thereof | Maitland Gary Graham, Xiaobo Shi | 2017-02-21 |
| 9305476 | Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof | Xiaobo Shi, John Edward Quincy Hughes, Hongjun Zhou, Daniel Hernandez Castillo, II, Jae-ouk Choo +6 more | 2016-04-05 |
| 9305806 | Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications | Xiaobo Shi, Krishna P. Murella, Jae-ouk Choo | 2016-04-05 |
| 9062230 | Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof | Xiaobo Shi, John Edward Quincy Hughes, Hongjun Zhou, Daniel Hernandez Castillo, II, Jae-ouk Choo +6 more | 2015-06-23 |
| 8999193 | Chemical mechanical polishing composition having chemical additives and methods for using same | Xiaobo Shi, Maitland Gary Graham, Savka Stoeva, James M. Henry | 2015-04-07 |
| 8974692 | Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications | Xiaobo Shi, Krishna P. Murella, Jae-ouk Choo | 2015-03-10 |
| 8859428 | Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof | Xiaobo Shi, John Edward Quincy Hughes, Hongjun Zhou, Daniel Hernandez Castillo, II, Jae-ouk Choo +6 more | 2014-10-14 |
| 7678605 | Method for chemical mechanical planarization of chalcogenide materials | Bentley J. Palmer | 2010-03-16 |
| 7195548 | Method and apparatus for post-CMP cleaning of a semiconductor work piece | Vishwas Hardikar, Guangshun Chen | 2007-03-27 |
| 7182673 | Method and apparatus for post-CMP cleaning of a semiconductor work piece | Vishwas Hardikar, Guangshun Chen | 2007-02-27 |
| 6095900 | Method for manufacturing a workpiece carrier backing pad and pressure plate for polishing semiconductor wafers | Clinton O. Fruitman, Thomas K. Crosby | 2000-08-01 |
| 5989104 | Workpiece carrier with monopiece pressure plate and low gimbal point | Inki Kim, Chris Karlsrud, John Natalicio, Thomas K. Crosby | 1999-11-23 |