Issued Patents All Time
Showing 1–25 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12234383 | Low dishing oxide CMP polishing compositions for shallow trench isolation applications and methods of making thereof | Krishna P. Murella, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2025-02-25 |
| 12091581 | High oxide film removal rate shallow trench (STI) chemical mechanical planarization (CMP) polishing | Krishna P. Murella, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2024-09-17 |
| 11718767 | Chemical mechanical planarization composition for polishing oxide materials and method of use thereof | Ming-Shih Tsai, Chia-Chien Lee, Rung-Je Yang, Anu Mallikarjunan, Chris Keh-Yeuan Li +2 more | 2023-08-08 |
| 11692110 | Low oxide trench dishing chemical mechanical polishing | Krishna P. Murella, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2023-07-04 |
| 11667839 | Low oxide trench dishing chemical mechanical polishing | Krishna P. Murella, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2023-06-06 |
| 11643599 | Tungsten chemical mechanical polishing for reduced oxide erosion | Chun Lu, Dnyanesh Chandrakant Tamboli, Reinaldo Mario Machado, Mark Leonard O'Neill, Matthias Stender | 2023-05-09 |
| 11608451 | Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with tunable silicon oxide and silicon nitride removal rates | Krishna P. Murella, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2023-03-21 |
| 11549034 | Oxide chemical mechanical planarization (CMP) polishing compositions | Krishna P. Murella, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2023-01-10 |
| 11401441 | Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications | Laura M. Matz, Chris Keh-Yeuan Li, Ming-Shih Tsai, Pao-Chia Pan, Chad Chang-Tse Hsieh +4 more | 2022-08-02 |
| 11326076 | Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with low abrasive concentration and a combination of chemical additives | Krishna P. Murella, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2022-05-10 |
| 11254839 | Low oxide trench dishing shallow trench isolation chemical mechanical planarization polishing | Joseph D. Rose, Hongjun Zhou, Krishna P. Murella, Mark Leonard O'Neill | 2022-02-22 |
| 11180678 | Suppressing SiN removal rates and reducing oxide trench dishing for Shallow Trench Isolation (STI) process | Krishna P. Murella, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2021-11-23 |
| 11104825 | Metal compound chemically anchored colloidal particles and methods of production and use thereof | Hongjun Zhou, Jo-Ann Theresa Schwartz | 2021-08-31 |
| 11078417 | Low oxide trench dishing chemical mechanical polishing | Krishna P. Murella, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2021-08-03 |
| 11072726 | Low oxide trench dishing chemical mechanical polishing | Krishna P. Murella, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2021-07-27 |
| 11066575 | Chemical mechanical planarization for tungsten-containing substrates | Hongjun Zhou, James Allen Schlueter, Jo-Ann Theresa Schwartz | 2021-07-20 |
| 10920106 | Metal chemical mechanical planarization (CMP) composition and methods therefore | Mark Leonard O'Neill | 2021-02-16 |
| 10745589 | Chemical mechanical polishing (CMP) of cobalt-containing substrate | Joseph D. Rose, Timothy Joseph Clore, James Allen Schlueter, Malcolm Grief, Mark Leonard O'Neill | 2020-08-18 |
| 10669449 | Composite abrasive particles for chemical mechanical planarization composition and method of use thereof | Hongjun Zhou, Jo-Ann Theresa Schwartz, Malcolm Grief, Krishna P. Murella, Steven Charles Winchester +5 more | 2020-06-02 |
| 10570313 | Dishing reducing in tungsten chemical mechanical polishing | Matthias Stender, Blake J. Lew | 2020-02-25 |
| 10465096 | Metal chemical mechanical planarization (CMP) composition and methods therefore | Mark Leonard O'Neill | 2019-11-05 |
| 10253216 | Additives for barrier chemical mechanical planarization | Matthias Stender, Maitland Gary Graham, Dnyanesh Chandrakant Tamboli | 2019-04-09 |
| 10217645 | Chemical mechanical polishing (CMP) of cobalt-containing substrate | James Allen Schlueter, Mark Leonard O'Neill | 2019-02-26 |
| 10160884 | Metal compound chemically anchored colloidal particles and methods of production and use thereof | Hongjun Zhou, Jo-Ann Theresa Schwartz | 2018-12-25 |
| 10109493 | Composite abrasive particles for chemical mechanical planarization composition and method of use thereof | Hongjun Zhou, Jo-Ann Theresa Schwartz, Malcolm Grief, Krishna P. Murella, Steven Charles Winchester +5 more | 2018-10-23 |