Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11401441 | Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications | Xiaobo Shi, Laura M. Matz, Chris Keh-Yeuan Li, Ming-Shih Tsai, Pao-Chia Pan +4 more | 2022-08-02 |
| 10570313 | Dishing reducing in tungsten chemical mechanical polishing | Matthias Stender, Xiaobo Shi | 2020-02-25 |