Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11401441 | Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications | Xiaobo Shi, Chris Keh-Yeuan Li, Ming-Shih Tsai, Pao-Chia Pan, Chad Chang-Tse Hsieh +4 more | 2022-08-02 |
| 10072237 | Photoresist cleaning composition used in photolithography and a method for treating substrate therewith | Randy Li-Kai Chang, Gene Everad Parris, Hsiu-Mei Chen, Yi-Chia Lee, Wen Dar Liu +3 more | 2018-09-11 |
| 9018107 | Low K precursors providing superior integration attributes | Mary Kathryn Haas, Raymond Nicholas Vrtis | 2015-04-28 |
| 8889235 | Dielectric barrier deposition using nitrogen containing precursor | Anupama Mallikarjunan, Raymond Nicholas Vrtis, Mark Leonard O'Neill, Andrew David Johnson, Manchao Xiao | 2014-11-18 |
| 8753986 | Low k precursors providing superior integration attributes | Mary Kathryn Haas, Raymond Nicholas Vrtis | 2014-06-17 |
| 8637396 | Dielectric barrier deposition using oxygen containing precursor | Raymond Nicholas Vrtis, Mark Leonard O'Neill, Dino Sinatore | 2014-01-28 |
| 8592058 | Methods of forming strontium titanate films | Xiangxin Rui, Xinjian Lei, Sunil Shanker, Moo-Sung Kim, Iain Buchanan | 2013-11-26 |
| 8507704 | Liquid composition containing aminoether for deposition of metal-containing films | Sergei Vladimirovich Ivanov, Xinjian Lei, Daniel P. Spence, John Anthony Thomas Norman | 2013-08-13 |
| 8471049 | Precursors for depositing group 4 metal-containing films | Xinjian Lei, Daniel P. Spence, Moo-Sung Kim, Iain Buchanan, Sergei Vladimirovich Ivanov | 2013-06-25 |
| 8283260 | Process for restoring dielectric properties | Scott J. Weigel, Mark Leonard O'Neill, Mary Kathryn Haas, Glenn Michael Mitchell, Aiping Wu +2 more | 2012-10-09 |
| 8202808 | Methods of forming strontium titanate films | Xiangxin Rui, Xinjian Lei, Sunil Shanker, Moo-Sung Kim, Iain Buchanan | 2012-06-19 |
| 8043976 | Adhesion to copper and copper electromigration resistance | Raymond Nicholas Vrtis, Mark Leonard O'Neill | 2011-10-25 |
| 7745238 | Monitoring of temperature variation across wafers during processing | Deepak A. Ramappa, Rosa A. Orozco-Teran | 2010-06-29 |
| 7741224 | Plasma treatment and repair processes for reducing sidewall damage in low-k dielectrics | Ping Jiang, Rosa A. Orozco-Teran | 2010-06-22 |
| 7682989 | Formation of a silicon oxide interface layer during silicon carbide etch stop deposition to promote better dielectric stack adhesion | Ting Tsui, Thad E. Briggs, Robert J. Kraft | 2010-03-23 |
| 7413994 | Hydrogen and oxygen based photoresist removal process | Patricia B. Smith, Vinay Shah | 2008-08-19 |