JN

John Anthony Thomas Norman

Air Products And Chemicals: 53 patents #5 of 1,997Top 1%
UI Uarco Incorporated: 2 patents #5 of 42Top 15%
VU Versum Materials Us: 2 patents #63 of 174Top 40%
📍 Encinitas, CA: #35 of 1,440 inventorsTop 3%
🗺 California: #6,332 of 386,348 inventorsTop 2%
Overall (All Time): #43,165 of 4,157,543Top 2%
57
Patents All Time

Issued Patents All Time

Showing 1–25 of 57 patents

Patent #TitleCo-InventorsDate
10914001 Volatile dihydropyrazinly and dihydropyrazine metal complexes Sergei Vladimirovich Ivanov, Xinjian Lei 2021-02-09
9994954 Volatile dihydropyrazinly and dihydropyrazine metal complexes Sergei Vladimirovich Ivanov, Xinjian Lei 2018-06-12
9018387 Complexes of imidazole ligands Melanie K. Perez, Xinjian Lei, Daniel P. Spence, Sergei Vladimirovich Ivanov, Wade Hampton Bailey, III 2015-04-28
8962875 Metal-enolate precursors for depositing metal-containing films Xinjian Lei 2015-02-24
8859785 Volatile group 2 metal precursors 2014-10-14
8703103 Volatile imidazoles and group 2 imidazole based metal precursors Melanie K. Perez, Moo-Sung Kim 2014-04-22
8680289 Complexes of imidazole ligands Melanie K. Perez, Xinjian Lei, Daniel P. Spence, Sergei Vladimirovich Ivanov, Wade Hampton Bailey, III 2014-03-25
8592606 Liquid precursor for depositing group 4 metal containing films Xinjian Lei, Daniel P. Spence 2013-11-26
8507704 Liquid composition containing aminoether for deposition of metal-containing films Sergei Vladimirovich Ivanov, Xinjian Lei, Daniel P. Spence, Laura M. Matz 2013-08-13
8313807 High coordination sphere group 2 metal β-diketiminate precursors Xinjian Lei 2012-11-20
8293001 Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants Raymond Nicholas Vrtis, Mark Leonard O'Neill, Jean Louise Vincent, Aaron Scott Lukas, Manchao Xiao 2012-10-23
8283485 Process for selectively depositing copper thin films on substrates with copper and ruthenium areas via vapor deposition 2012-10-09
8263795 Copper precursors for thin film deposition Melanie K. Perez 2012-09-11
8143431 Low temperature thermal conductive inks Melanie K. Perez, Robert K. Pinschmidt, Jr. 2012-03-27
7985449 Methods for depositing metal films onto diffusion barrier layers by CVD or ALD processes Diwakar Garg, Hansong Cheng, Eduardo Machado, Pablo Ordejon 2011-07-26
7943195 Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants Raymond Nicholas Vrtis, Mark Leonard O'Neill, Jean Louise Vincent, Aaron Scott Lukas, Manchao Xiao 2011-05-17
7919409 Materials for adhesion enhancement of copper film on diffusion barriers Hansong Cheng, Xinjian Lei, Daniel P. Spence, David A. Roberts, Bo Han +2 more 2011-04-05
7754906 Ti, Ta, Hf, Zr and related metal silicon amides for ALD/CVD of metal-silicon nitrides, oxides or oxynitrides Xinjian Lei 2010-07-13
7524533 Diffusion barrier layers and processes for depositing metal films thereupon by CVD or ALD processes Diwakar Garg, Hansong Cheng, Eduardo Machado, Pablo Ordejon 2009-04-28
7384471 Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants Raymond Nicholas Vrtis, Mark Leonard O'Neill, Jean Louise Vincent, Aaron Scott Lukas, Manchao Xiao 2008-06-10
7311946 Methods for depositing metal films on diffusion barrier layers by CVD or ALD processes Diwakar Garg, Hansong Cheng, Eduardo Machado, Pablo Ordejon 2007-12-25
7205422 Volatile metal β-ketoiminate and metal β-diiminate complexes 2007-04-17
7034169 Volatile metal β-ketoiminate complexes 2006-04-25
6869876 Process for atomic layer deposition of metal films David A. Roberts, Melanie Boze 2005-03-22
6846515 Methods for using porogens and/or porogenated precursors to provide porous organosilica glass films with low dielectric constants Raymond Nicholas Vrtis, Mark Leonard O'Neill, Jean Louise Vincent, Aaron Scott Lukas, Manchao Xiao 2005-01-25