Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11718767 | Chemical mechanical planarization composition for polishing oxide materials and method of use thereof | Ming-Shih Tsai, Chia-Chien Lee, Rung-Je Yang, Anu Mallikarjunan, Hongjun Zhou +2 more | 2023-08-08 |
| 11401441 | Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications | Xiaobo Shi, Laura M. Matz, Ming-Shih Tsai, Pao-Chia Pan, Chad Chang-Tse Hsieh +4 more | 2022-08-02 |