Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10566231 | Interconnect formation with chamferless via, and related interconnect | Martin O'Toole, Christopher J. Penny, Adam L. da Silva, Craig Child, Terry A. Spooner +3 more | 2020-02-18 |
| 10011741 | Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof | Xiaobo Shi, John Edward Quincy Hughes, Hongjun Zhou, Daniel Hernandez Castillo, II, James Allen Schlueter +6 more | 2018-07-03 |
| 9305476 | Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof | Xiaobo Shi, John Edward Quincy Hughes, Hongjun Zhou, Daniel Hernandez Castillo, II, James Allen Schlueter +6 more | 2016-04-05 |
| 9305806 | Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications | Xiaobo Shi, Krishna P. Murella, James Allen Schlueter | 2016-04-05 |
| 9062230 | Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof | Xiaobo Shi, John Edward Quincy Hughes, Hongjun Zhou, Daniel Hernandez Castillo, II, James Allen Schlueter +6 more | 2015-06-23 |
| 8974692 | Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications | Xiaobo Shi, Krishna P. Murella, James Allen Schlueter | 2015-03-10 |
| 8859428 | Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof | Xiaobo Shi, John Edward Quincy Hughes, Hongjun Zhou, Daniel Hernandez Castillo, II, James Allen Schlueter +6 more | 2014-10-14 |
| 7902609 | Semiconductor devices including multiple stress films in interface area | Seo-woo Nam, Ki-Chul Kim, Young-joon Moon, Hong-Jae Shin, Nae-In Lee | 2011-03-08 |
| 7785951 | Methods of forming integrated circuit devices having tensile and compressive stress layers therein and devices formed thereby | Seo-woo Nam, Il-young Yoon, Hong-Jae Shin, Nae-In Lee | 2010-08-31 |
| 7642148 | Methods of producing semiconductor devices including multiple stress films in interface area | Seo-woo Nam, Ki-Chul Kim, Young-joon Moon, Hong-Jae Shin, Nae-In Lee | 2010-01-05 |
| 7595253 | Method of forming the semiconductor device | II Young YOON, Hong-Jae Shin, Nae-In Lee, Ja-Eung Koo | 2009-09-29 |
| 7452817 | CMP method providing reduced thickness variations | Ilyoung Yoon, Jaeung Koo | 2008-11-18 |