Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373842 | Composition and method used for chemical mechanical planarization of metals | Song-Yuan Chang, Mark Evans, Dnyanesh Chandrakant Tamboli | 2019-08-06 |
| 6350690 | Process for achieving full global planarization during CMP of damascene semiconductor structures | Gary Paul Schwartz, Ramachandran Muralidhar | 2002-02-26 |
| 6168704 | Site-selective electrochemical deposition of copper | Thomas Meredith Brown | 2001-01-02 |