Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6350690 | Process for achieving full global planarization during CMP of damascene semiconductor structures | Ramachandran Muralidhar, Stephen W. Hymes | 2002-02-26 |
| 5885900 | Method of global planarization in fabricating integrated circuit devices | — | 1999-03-23 |