MG

Malcolm Grief

Micron: 20 patents #865 of 6,345Top 15%
VU Versum Materials Us: 4 patents #43 of 174Top 25%
SP Speedfam-Ipec: 3 patents #33 of 143Top 25%
ME Medtronic: 3 patents #2,453 of 6,325Top 40%
U.S. Philips: 2 patents #2,537 of 8,851Top 30%
SC Speedfam Co.: 1 patents #48 of 105Top 50%
📍 Phoenix, AZ: #134 of 6,660 inventorsTop 3%
🗺 Arizona: #799 of 32,909 inventorsTop 3%
Overall (All Time): #103,047 of 4,157,543Top 3%
34
Patents All Time

Issued Patents All Time

Showing 26–34 of 34 patents

Patent #TitleCo-InventorsDate
6124721 Method of engaging electrically conductive test pads on a semiconductor substrate Warren M. Farnworth, Gurtej S. Sandhu 2000-09-26
5738562 Apparatus and method for planar end-point detection during chemical-mechanical polishing Trung T. Doan, Gurtej S. Sandhu 1998-04-14
5523697 Testing apparatus for engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof Warren M. Farnworth, Gurtej S. Sandhu 1996-06-04
5514245 Method for chemical planarization (CMP) of a semiconductor wafer to provide a planar surface free of microscratches Trung T. Doan, Laurence D. Schultz 1996-05-07
5326428 Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability Warren M. Farnworth, Gurtej S. Sandhu 1994-07-05
RE34583 Method of forming a configuration of interconnections on a semiconductor device having a high integration density Trung T. Doan, Hendrikus J. W. van Houtum, Josephus M. F. G. Van Laarhoven 1994-04-12
5166093 Method to reduce the reflectivity of a semi-conductor metallic surface 1992-11-24
5136362 Electrical contact with diffusion barrier Trung T. Doan 1992-08-04
4936950 Method of forming a configuration of interconnections on a semiconductor device having a high integration density Trung T. Doan, Leendert De Bruin, Harald Godon 1990-06-26