LS

Laurence D. Schultz

Micron: 9 patents #1,566 of 6,345Top 25%
AT AT&T: 3 patents #5,550 of 18,772Top 30%
AS Agere Systems: 2 patents #639 of 1,849Top 35%
MT Microelectronic & Computer Technology: 1 patents #56 of 112Top 50%
TI Texas Instruments: 1 patents #7,357 of 12,488Top 60%
Overall (All Time): #300,921 of 4,157,543Top 8%
16
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7695589 Versatile system for conditioning slurry in CMP process David Anthony Stark, Neal Murphy 2010-04-13
6896583 Method and apparatus for conditioning a polishing pad Jose Omar Rodriquez, Charles Storey 2005-05-24
6702654 Conditioning wheel for conditioning a semiconductor wafer polishing pad and method of manufacture thereof Arun K. Nanda, Jose Omar Rodriguez, Charles Storey 2004-03-09
6083838 Method of planarizing a surface on a semiconductor wafer Randolph H. Burton, Yaw S. Obeng 2000-07-04
6056630 Polishing apparatus with carrier head pivoting device Arun K. Nanda 2000-05-02
6048256 Apparatus and method for continuous delivery and conditioning of a polishing slurry Yaw S. Obeng 2000-04-11
5980363 Under-pad for chemical-mechanical planarization of semiconductor wafers Scott Meikle 1999-11-09
5871392 Under-pad for chemical-mechanical planarization of semiconductor wafers Scott Meikle 1999-02-16
5514245 Method for chemical planarization (CMP) of a semiconductor wafer to provide a planar surface free of microscratches Trung T. Doan, Malcolm Grief 1996-05-07
5421769 Apparatus for planarizing semiconductor wafers, and a polishing pad for a planarization apparatus Mark E. Tuttle, Trung T. Doan 1995-06-06
RE34425 Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer 1993-11-02
5234867 Method for planarizing semiconductor wafers with a non-circular polishing pad Mark E. Tuttle, Trung T. Doan 1993-08-10
5081796 Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer 1992-01-21
5069002 Apparatus for endpoint detection during mechanical planarization of semiconductor wafers Gurtej S. Sandhu, Trung T. Doan 1991-12-03
5036015 Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers Gurtej S. Sandhu, Trung T. Doan 1991-07-30
5011580 Method of reworking an electrical multilayer interconnect Ju-Don T. Pan, John Curry 1991-04-30