Laurence D. Schultz — 16 Patents at Micron

Laurence D. Schultz has been granted 16 US patents while listed as an inventor at Micron. The first was granted in 1991 and the most recent in April 2010. Laurence D. Schultz ranks #284,196 of 4,157,543 US inventors in our database (top 6.8%). Patent records list Laurence D. Schultz in Boise, ID, US.

Patents per Year

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Showing 1–16 of 16 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
7695589	Versatile system for conditioning slurry in CMP process	David Anthony Stark, Neal Murphy	2010-04-13	$14,416,000
6896583	Method and apparatus for conditioning a polishing pad	Jose Omar Rodriquez, Charles Storey	2005-05-24
6702654	Conditioning wheel for conditioning a semiconductor wafer polishing pad and method of manufacture thereof	Arun K. Nanda, Jose Omar Rodriguez, Charles Storey	2004-03-09
6083838	Method of planarizing a surface on a semiconductor wafer	Randolph H. Burton, Yaw S. Obeng	2000-07-04
6056630	Polishing apparatus with carrier head pivoting device	Arun K. Nanda	2000-05-02	$96,316,000
6048256	Apparatus and method for continuous delivery and conditioning of a polishing slurry	Yaw S. Obeng	2000-04-11	$67,246,000
5980363	Under-pad for chemical-mechanical planarization of semiconductor wafers	Scott Meikle	1999-11-09	$11,356,000
5871392	Under-pad for chemical-mechanical planarization of semiconductor wafers	Scott Meikle	1999-02-16	$18,099,000
5514245	Method for chemical planarization (CMP) of a semiconductor wafer to provide a planar surface free of microscratches	Trung T. Doan, Malcolm Grief	1996-05-07	$51,608,000
5421769	Apparatus for planarizing semiconductor wafers, and a polishing pad for a planarization apparatus	Mark E. Tuttle, Trung T. Doan	1995-06-06	$52,953,000
RE34425	Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer	—	1993-11-02
5234867	Method for planarizing semiconductor wafers with a non-circular polishing pad	Mark E. Tuttle, Trung T. Doan	1993-08-10	$2,781,000
5081796	Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer	—	1992-01-21	$2,568,000
5069002	Apparatus for endpoint detection during mechanical planarization of semiconductor wafers	Gurtej S. Sandhu, Trung T. Doan	1991-12-03	$2,153,000
5036015	Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers	Gurtej S. Sandhu, Trung T. Doan	1991-07-30	$6,773,000
5011580	Method of reworking an electrical multilayer interconnect	Ju-Don T. Pan, John Curry	1991-04-30

Laurence D. Schultz — 16 Patents

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