Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer

Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer

US Patent 5081796 · Granted Jan 21, 1992

Estimated economic value: $2,568,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Versatile system for conditioning slurry in CMP process2010
Method and apparatus for conditioning a polishing pad2005
Conditioning wheel for conditioning a semiconductor wafer polishing pad and meth2004
Method of planarizing a surface on a semiconductor wafer2000
Polishing apparatus with carrier head pivoting device2000
Apparatus and method for continuous delivery and conditioning of a polishing slu2000
Under-pad for chemical-mechanical planarization of semiconductor wafers1999
Under-pad for chemical-mechanical planarization of semiconductor wafers1999
Method for chemical planarization (CMP) of a semiconductor wafer to provide a pl1996
Apparatus for planarizing semiconductor wafers, and a polishing pad for a planar1995
Method and apparatus for mechanical planarization and endpoint detection of a se1993
Method for planarizing semiconductor wafers with a non-circular polishing pad1993