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Home › Methods of engaging electrically conductive test pads on a semiconductor substrate removable electrical interconnect apparatuses, engagement probes and removable engagement probes

Methods of engaging electrically conductive test pads on a semiconductor substrate removable electrical interconnect apparatuses, engagement probes and removable engagement probes

US Patent 6657450 · Granted Dec 2, 2003

Estimated economic value: $2,846,000 ⓘ

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