Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7442578 | Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling micoelectronic devices | Tongbi Jiang, Warren M. Farnworth | 2008-10-28 |
| 7170184 | Treatment of a ground semiconductor die to improve adhesive bonding to a substrate | Tongbi Jiang, Mike Connell, Li Li | 2007-01-30 |
| 7094628 | Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices | Tongbi Jiang, Warren M. Farnworth | 2006-08-22 |
| 6812064 | Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate | Tongbi Jiang, Mike Connell, Li Li | 2004-11-02 |
| 6768209 | UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, MICROELECTRONIC DEVICES HAVING UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, AND METHODS OF UNDERFILLING MICROELECTRONIC DEVICES | Tongbi Jiang, Warren M. Farnworth | 2004-07-27 |