Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8461685 | Substrate comprising a plurality of integrated circuitry die, and a substrate | Tongbi Jiang | 2013-06-11 |
| 7537966 | Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer | Tongbi Jiang | 2009-05-26 |
| 7510017 | Sealing and communicating in wells | Matt Howell, James C. Tucker | 2009-03-31 |
| 7479413 | Method for fabricating semiconductor package with circuit side polymer layer | Tongbi Jiang | 2009-01-20 |
| 7170184 | Treatment of a ground semiconductor die to improve adhesive bonding to a substrate | Tongbi Jiang, Li Li, Curtis Hollingshead | 2007-01-30 |
| 7078267 | Methods of fabricating integrated circuitry | Tongbi Jiang | 2006-07-18 |
| 6995041 | Semiconductor package with circuit side polymer layer and wafer level fabrication method | Tongbi Jiang | 2006-02-07 |
| 6949834 | Stacked semiconductor package with circuit side polymer layer | Tongbi Jiang | 2005-09-27 |
| 6881606 | Method for forming a protective layer for use in packaging a semiconductor die | Tongbi Jiang, Zhiping Yin | 2005-04-19 |
| 6812064 | Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate | Tongbi Jiang, Li Li, Curtis Hollingshead | 2004-11-02 |
| 6791168 | Semiconductor package with circuit side polymer layer and wafer level fabrication method | Tongbi Jiang | 2004-09-14 |
| D442749 | Spray arch for vehicle washing machine | Allen S. Jones | 2001-05-22 |