Mike Connell — 12 Patents at Micron

Mike Connell has been granted 12 US patents while listed as an inventor at Micron. The first was granted in 2001 and the most recent in June 2013. Mike Connell ranks #396,045 of 4,157,543 US inventors in our database (top 9.5%). Patent records list Mike Connell in Oneida, WI, US.

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8461685	Substrate comprising a plurality of integrated circuitry die, and a substrate	Tongbi Jiang	2013-06-11	$4,425,000
7537966	Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer	Tongbi Jiang	2009-05-26	$2,939,000
7510017	Sealing and communicating in wells	Matt Howell, James C. Tucker	2009-03-31	$28,031,000
7479413	Method for fabricating semiconductor package with circuit side polymer layer	Tongbi Jiang	2009-01-20	$3,797,000
7170184	Treatment of a ground semiconductor die to improve adhesive bonding to a substrate	Tongbi Jiang, Li Li, Curtis Hollingshead	2007-01-30	$2,478,000
7078267	Methods of fabricating integrated circuitry	Tongbi Jiang	2006-07-18	$2,294,000
6995041	Semiconductor package with circuit side polymer layer and wafer level fabrication method	Tongbi Jiang	2006-02-07	$2,952,000
6949834	Stacked semiconductor package with circuit side polymer layer	Tongbi Jiang	2005-09-27	$1,169,000
6881606	Method for forming a protective layer for use in packaging a semiconductor die	Tongbi Jiang, Zhiping Yin	2005-04-19	$902,000
6812064	Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate	Tongbi Jiang, Li Li, Curtis Hollingshead	2004-11-02	$1,227,000
6791168	Semiconductor package with circuit side polymer layer and wafer level fabrication method	Tongbi Jiang	2004-09-14	$1,322,000
D442749	Spray arch for vehicle washing machine	Allen S. Jones	2001-05-22

Mike Connell — 12 Patents

Issued Patents All Time

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