Issued Patents All Time
Showing 51–61 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5952840 | Apparatus for testing semiconductor wafers | Warren M. Farnworth, Salman Akram, Alan G. Wood, David R. Hembree, James M. Wark | 1999-09-14 |
| 5931685 | Interconnect for making temporary electrical connections with bumped semiconductor components | David R. Hembree, James M. Wark, Warren M. Farnworth, Salman Akram, Alan G. Wood | 1999-08-03 |
| 5920513 | Partial replacement of partially defective memory devices | — | 1999-07-06 |
| 5915977 | System and interconnect for making temporary electrical connections with bumped semiconductor components | David R. Hembree, James M. Wark, Warren M. Farnworth, Salman Akram, Alan G. Wood | 1999-06-29 |
| 5907492 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 1999-05-25 |
| 5895222 | Encapsulant dam standoff for shell-enclosed die assemblies | Walter L. Moden | 1999-04-20 |
| 5894218 | Method and apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, Alan G. Wood, David R. Hembree, James M. Wark, Jennifer L. Folaron +3 more | 1999-04-13 |
| 5894167 | Encapsulant dam standoff for shell-enclosed die assemblies | Walter L. Moden | 1999-04-13 |
| 5893726 | Semiconductor package with pre-fabricated cover and method of fabrication | Warren M. Farnworth, David R. Hembree, Derek Gochnour, Salman Akram, James M. Wark +1 more | 1999-04-13 |
| 5786632 | Semiconductor package | Warren M. Farnworth, Alan G. Wood, Trung T. Doan | 1998-07-28 |
| 5593927 | Method for packaging semiconductor dice | Warren M. Farnworth, Alan G. Wood, Trung T. Doan | 1997-01-14 |