Issued Patents All Time
Showing 101–125 of 173 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6376918 | Underfill of a bumped or raised die utilizing a barrier adjacent to the side wall of slip chip | Salman Akram | 2002-04-23 |
| 6369600 | Test carrier for testing semiconductor components including interconnect with support members for preventing component flexure | Warren M. Farnworth, Mike Hess, David R. Hembree, John O. Jacobson, Salman Akram | 2002-04-09 |
| 6363295 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 2002-03-26 |
| 6362637 | Apparatus for testing semiconductor wafers including base with contact members and terminal contacts | Warren M. Farnworth, Salman Akram, Alan G. Wood, David R. Hembree, John O. Jacobson | 2002-03-26 |
| 6353326 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour +2 more | 2002-03-05 |
| 6342724 | Thin film capacitor coupons for memory modules and multi-chip modules | Salman Akram | 2002-01-29 |
| 6337574 | Method and apparatus for testing bumped die | — | 2002-01-08 |
| 6307394 | Test carrier with variable force applying mechanism for testing semiconductor components | Warren M. Farnworth, Salman Akram, Derek Gochnour | 2001-10-23 |
| 6303993 | Method and apparatus for testing bumped die | — | 2001-10-16 |
| 6299456 | Interposer with contact structures for electrical testing | Salman Akram | 2001-10-09 |
| 6297660 | Test carrier with variable force applying mechanism for testing semiconductor components | Warren M. Farnworth, Salman Akram, Derek Gochnour | 2001-10-02 |
| 6295978 | Method for reducing damage to wafer cutting blades during wafer dicing | Salman Akram | 2001-10-02 |
| 6291897 | Carriers including projected contact structures for engaging bumped semiconductor devices | Salman Akram | 2001-09-18 |
| 6279758 | Apparatus and method for facilitating circuit board processing | Michael J. Bettinger | 2001-08-28 |
| 6274390 | Method and apparatus providing redundancy for fabricating highly reliable memory modules | Salman Akram, David R. Hembree | 2001-08-14 |
| 6253758 | Apparatus for reducing damage to wafer cutting blades during wafer dicing | Salman Akram | 2001-07-03 |
| 6253755 | Method for reducing damage to wafer cutting blades during wafer dicing | Salman Akram | 2001-07-03 |
| 6252308 | Packaged die PCB with heat sink encapsulant | Salman Akram | 2001-06-26 |
| 6239590 | Calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, Warren M. Farnworth, David R. Hembree, Salman Akram, John O. Jacobson | 2001-05-29 |
| 6240535 | Device and method for testing integrated circuit dice in an integrated circuit module | Warren M. Farnworth, Eric S. Nelson, Kevin G. Duesman | 2001-05-29 |
| 6234373 | Electrically conductive elevation shaping tool | — | 2001-05-22 |
| 6215181 | Method and apparatus providing redundancy for fabricating highly reliable memory modules | Salman Akram, David R. Hembree | 2001-04-10 |
| 6214635 | Method and apparatus for underfill of bumped or raised die | Salman Akram | 2001-04-10 |
| 6210984 | Method and apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, David R. Hembree, Jennifer L. Folaron +3 more | 2001-04-03 |
| 6204678 | Direct connect interconnect for testing semiconductor dice and wafers | Salman Akram, Warren M. Farnworth | 2001-03-20 |