Issued Patents All Time
Showing 151–173 of 173 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5984164 | Method of using an electrically conductive elevation shaping tool | — | 1999-11-16 |
| 5982018 | Thin film capacitor coupons for memory modules and multi-chip modules | Salman Akram | 1999-11-09 |
| 5973404 | Underfill of bumped or raised die using a barrier adjacent to the sidewall of semiconductor device | Salman Akram | 1999-10-26 |
| 5973403 | Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice | — | 1999-10-26 |
| 5959310 | Multi-chip module system | Salman Akram, David R. Hembree | 1999-09-28 |
| 5955877 | Method and apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, David R. Hembree, Jennifer L. Folaron +3 more | 1999-09-21 |
| 5952840 | Apparatus for testing semiconductor wafers | Warren M. Farnworth, Salman Akram, Alan G. Wood, David R. Hembree, John O. Jacobson | 1999-09-14 |
| 5950613 | Apparatus and method for reducing damage to wafer cutting blades during wafer dicing | Salman Akram | 1999-09-14 |
| 5931685 | Interconnect for making temporary electrical connections with bumped semiconductor components | David R. Hembree, John O. Jacobson, Warren M. Farnworth, Salman Akram, Alan G. Wood | 1999-08-03 |
| 5929521 | Projected contact structure for bumped semiconductor device and resulting articles and assemblies | Salman Akram | 1999-07-27 |
| 5915977 | System and interconnect for making temporary electrical connections with bumped semiconductor components | David R. Hembree, John O. Jacobson, Warren M. Farnworth, Salman Akram, Alan G. Wood | 1999-06-29 |
| 5911329 | Apparatus and method for facilitating circuit board processing | Michael J. Bettinger | 1999-06-15 |
| 5907492 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 1999-05-25 |
| 5893726 | Semiconductor package with pre-fabricated cover and method of fabrication | Warren M. Farnworth, David R. Hembree, Derek Gochnour, Salman Akram, John O. Jacobson +1 more | 1999-04-13 |
| 5894218 | Method and apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, David R. Hembree, Jennifer L. Folaron +3 more | 1999-04-13 |
| 5866953 | Packaged die on PCB with heat sink encapsulant | Salman Akram | 1999-02-02 |
| 5847445 | Die assemblies using suspended bond wires, carrier substrates and dice having wire suspension structures, and methods of fabricating same | Salman Akram | 1998-12-08 |
| 5817540 | Method of fabricating flip-chip on leads devices and resulting assemblies | — | 1998-10-06 |
| 5809987 | Apparatus for reducing damage to wafer cutting blades during wafer dicing | Salman Akram | 1998-09-22 |
| 5807762 | Multi-chip module system and method of fabrication | Salman Akram, David R. Hembree | 1998-09-15 |
| 5796746 | Device and method for testing integrated circuit dice in an integrated circuit module | Warren M. Farnworth, Eric S. Nelson, Kevin G. Duesman | 1998-08-18 |
| 5766982 | Method and apparatus for underfill of bumped or raised die | Salman Akram | 1998-06-16 |
| 5696031 | Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice | — | 1997-12-09 |