Issued Patents All Time
Showing 126–150 of 173 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6200144 | Interposer/converter to allow single-sided contact to circuit modules | — | 2001-03-13 |
| 6194243 | Method of production an underfill of a bumped or raised die using a barrier adjacent to the sidewall of a semiconductor device | Salman Akram | 2001-02-27 |
| 6165814 | Thin film capacitor coupons for memory modules and multi-chip modules | Salman Akram | 2000-12-26 |
| 6158595 | Apparatus and method for facilitating circuit board processing | Michael J. Bettinger | 2000-12-12 |
| 6150828 | Method and apparatus for automatically positioning electronic dice with component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, David R. Hembree, Jennifer L. Folaron +3 more | 2000-11-21 |
| 6140827 | Method and apparatus for testing bumped die | — | 2000-10-31 |
| 6140149 | Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice | — | 2000-10-31 |
| 6112740 | Method for reducing damage to wafer cutting blades during wafer dicing | Salman Akram | 2000-09-05 |
| 6087676 | Multi-chip module system | Salman Akram, David R. Hembree | 2000-07-11 |
| 6078186 | Force applying probe card and test system for semiconductor wafers | David R. Hembree, Warren M. Farnworth | 2000-06-20 |
| 6071754 | Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice | — | 2000-06-06 |
| 6072323 | Temporary package, and method system for testing semiconductor dice having backside electrodes | David R. Hembree, Salman Akram, Warren M. Farnworth | 2000-06-06 |
| 6067977 | Apparatus and method for reducing damage to wafer cutting blades during wafer dicing | Salman Akram | 2000-05-30 |
| 6066509 | Method and apparatus for underfill of bumped or raised die | Salman Akram | 2000-05-23 |
| 6064216 | Apparatus for testing semiconductor wafers | Warren M. Farnworth, Salman Akram, Alan G. Wood, David R. Hembree, John O. Jacobson | 2000-05-16 |
| 6060769 | Flip-chip on leads devices | — | 2000-05-09 |
| 6060894 | Temporary package, method and system for testing semiconductor dice having backside electrodes | David R. Hembree, Salman Akram, Warren M. Farnworth | 2000-05-09 |
| 6060339 | Method and apparatus providing redundancy for fabricating highly reliable memory modules | Salman Akram, David R. Hembree | 2000-05-09 |
| 6057597 | Semiconductor package with pre-fabricated cover | Warren M. Farnworth, David R. Hembree, Derek Gochnour, Salman Akram, John O. Jacobson +1 more | 2000-05-02 |
| 6025730 | Direct connect interconnect for testing semiconductor dice and wafers | Salman Akram, Warren M. Farnworth | 2000-02-15 |
| 6025731 | Hybrid interconnect and system for testing semiconductor dice | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour | 2000-02-15 |
| 6008538 | Method and apparatus providing redundancy for fabricating highly reliable memory modules | Salman Akram, David R. Hembree | 1999-12-28 |
| 6004142 | Interposer converter to allow single-sided contact to circuit modules | — | 1999-12-21 |
| 5992649 | Apparatus and method for facilitating circuit board processing | Michael J. Bettinger | 1999-11-30 |
| 5988619 | Apparatus and method for facilitating circuit board processing | Michael J. Bettinger | 1999-11-23 |