Issued Patents All Time
Showing 51–75 of 173 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7162796 | Method of making an interposer with contact structures | Salman Akram | 2007-01-16 |
| 7159311 | Method of making an interposer with contact structures | Salman Akram | 2007-01-09 |
| 7161250 | Projected contact structures for engaging bumped semiconductor devices and methods of making the same | Salman Akram | 2007-01-09 |
| 7155300 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 2006-12-26 |
| 7120513 | Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 2006-10-10 |
| 7115495 | Methods of making projected contact structures for engaging bumped semiconductor devices | Salman Akram | 2006-10-03 |
| 7109059 | Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice | — | 2006-09-19 |
| 7060526 | Wafer level methods for fabricating multi-dice chip scale semiconductor components | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, David R. Hembree, Kyle K. Kirby +1 more | 2006-06-13 |
| 7049840 | Hybrid interconnect and system for testing semiconductor dice | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour | 2006-05-23 |
| 7034560 | Device and method for testing integrated circuit dice in an integrated circuit module | Warren M. Farnworth, Eric S. Nelson, Kevin G. Duesman | 2006-04-25 |
| 7005870 | Interconnect bump plate | — | 2006-02-28 |
| 6998717 | Multi-dice chip scale semiconductor components | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, David R. Hembree, Kyle K. Kirby +1 more | 2006-02-14 |
| 6998334 | Semiconductor devices with permanent polymer stencil and method for manufacturing the same | Warren M. Farnworth, Alan G. Wood, David R. Hembree, Syed Sajid Ahmad, Michael E. Hess +1 more | 2006-02-14 |
| 6927589 | Apparatus for testing bumped die | — | 2005-08-09 |
| 6900459 | Apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, David R. Hembree, Jennifer L. Folaron +3 more | 2005-05-31 |
| 6869826 | Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice | — | 2005-03-22 |
| 6853069 | Packaged die on PCB with heat sink encapsulant and methods | Salman Akram | 2005-02-08 |
| 6841883 | Multi-dice chip scale semiconductor components and wafer level methods of fabrication | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, David R. Hembree, Kyle K. Kirby +1 more | 2005-01-11 |
| 6841868 | Memory modules including capacity for additional memory | Salman Akram, David R. Hembree | 2005-01-11 |
| 6815817 | Underfill of a bumped or raised die utilizing barrier adjacent to the side wall of a flip-chip | Salman Akram | 2004-11-09 |
| 6801048 | Device and method for testing integrated circuit dice in an integrated circuit module | Warren M. Farnworth, Eric S. Nelson, Kevin G. Duesman | 2004-10-05 |
| 6782613 | Method of making an interposer with contact structures | Salman Akram | 2004-08-31 |
| 6730526 | Multi-chip module system and method of fabrication | Salman Akram, David R. Hembree | 2004-05-04 |
| 6720652 | Apparatus providing redundancy for fabricating highly reliable memory modules | Salman Akram, David R. Hembree | 2004-04-13 |
| 6710614 | Methods for using an interposer/converter to allow single-sided contact to circuit modules | — | 2004-03-23 |