{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Devices including sloped vias in a substrate and devices including spring-like deflecting contacts", "item": "https://www.patentleaderboard.com/patent/7928579"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Devices including sloped vias in a substrate and devices including spring-like deflecting contacts

Devices including sloped vias in a substrate and devices including spring-like deflecting contacts

US Patent 7928579 · Granted Apr 19, 2011

Estimated economic value: $3,891,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor devices comprising nickel— and copper—containing interconnects2019
Semiconductor devices comprising nickel- and copper-containing interconnects2018
Methods of forming interconnects and semiconductor structures2017
Through-wafer interconnects for photoimager and memory wafers2014
Methods of forming interconnects in a semiconductor structure2014
Through-wafer interconnects for photoimager and memory wafers2013
Methods of forming conductive vias2012
Methods for fabricating and filling conductive vias and conductive vias so forme2012
Microelectronic imagers with optical devices having integral reference features 2011
Through-wafer interconnects for photoimager and memory wafers2011
Methods for fabricating and filling conductive vias and conductive vias so forme2011
Semiconductor device structures including nickel plated aluminum, copper, and tu2010