{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures", "item": "https://www.patentleaderboard.com/patent/7855454"}]}
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Home › Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures

Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures

US Patent 7855454 · Granted Dec 21, 2010

Estimated economic value: $4,496,000 ⓘ

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