Issued Patents All Time
Showing 76–100 of 366 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7459393 | Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, Kyle K. Kirby +1 more | 2008-12-02 |
| 7452743 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level | Steven Oliver, Lu Velicky, William M. Hiatt, Mark E. Tuttle, Sidney B. Rigg +3 more | 2008-11-18 |
| 7419299 | Methods of sensing temperature of an electronic device workpiece | Salman Akram | 2008-09-02 |
| 7419841 | Microelectronic imagers and methods of packaging microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Kyle K. Kirby, Peter Benson +4 more | 2008-09-02 |
| 7394267 | Compliant contact pin assembly and card system | Kyle K. Kirby, Warren M. Farnworth, James M. Wark, William M. Hiatt, Alan G. Wood | 2008-07-01 |
| 7393770 | Backside method for fabricating semiconductor components with conductive interconnects | Alan G. Wood, William M. Hiatt | 2008-07-01 |
| 7387119 | Dicing saw with variable indexing capability | Salman Akram, Derek Gochnour, Michael E. Hess | 2008-06-17 |
| 7371676 | Method for fabricating semiconductor components with through wire interconnects | — | 2008-05-13 |
| 7358751 | Contact pin assembly and contactor card | Kyle K. Kirby, Warren M. Farnworth, James M. Wark, William M. Hiatt, Alan G. Wood | 2008-04-15 |
| 7341881 | Methods of packaging and testing microelectronic imaging devices | Charles M. Watkins, Peter Benson, Salman Akram | 2008-03-11 |
| 7329943 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Kyle K. Kirby, Salman Akram, Sidney B. Rigg, Warren M. Farnworth, William M. Hiatt | 2008-02-12 |
| 7307348 | Semiconductor components having through wire interconnects (TWI) | Alan G. Wood | 2007-12-11 |
| 7300857 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, Mark Hiatt, James M. Wark, Warren M. Farnworth +6 more | 2007-11-27 |
| 7297563 | Method of making contact pin card system | Kyle K. Kirby, Warren M. Farnworth, James M. Wark, William M. Hiatt, Alan G. Wood | 2007-11-20 |
| 7287326 | Methods of forming a contact pin assembly | Kyle K. Kirby, Warren M. Farnworth, James M. Wark, William M. Hiatt, Alan G. Wood | 2007-10-30 |
| 7288954 | Compliant contact pin test assembly and methods thereof | Kyle K. Kirby, Warren M. Farnworth, James M. Wark, William M. Hiatt, Alan G. Wood | 2007-10-30 |
| 7282806 | Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material | Warren M. Farnworth | 2007-10-16 |
| 7282932 | Compliant contact pin assembly, card system and methods thereof | Kyle K. Kirby, Warren M. Farnworth, James M. Wark, William M. Hiatt, Alan G. Wood | 2007-10-16 |
| 7265330 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more | 2007-09-04 |
| 7262405 | Prefabricated housings for microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt | 2007-08-28 |
| 7253390 | Methods for packaging microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt | 2007-08-07 |
| 7250780 | Probe card for semiconductor wafers having mounting plate and socket | Warren M. Farnworth, Salman Akram, Alan G. Wood, C. Patrick Doherty, Andrew J. Krivy | 2007-07-31 |
| 7245136 | Methods of processing a workpiece, methods of communicating signals with respect to a wafer, and methods of communicating signals within a workpiece processing apparatus | — | 2007-07-17 |
| 7244637 | Chip on board and heat sink attachment methods | — | 2007-07-17 |
| 7239933 | Substrate supports for use with programmable material consolidation apparatus and systems | William M. Hiatt, Warren M. Farnworth, Peter Benson | 2007-07-03 |