Issued Patents All Time
Showing 126–150 of 366 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6903443 | Semiconductor component and interconnect having conductive members and contacts on opposing sides | Warren M. Farnworth, Alan G. Wood | 2005-06-07 |
| 6900459 | Apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, James M. Wark, Jennifer L. Folaron +3 more | 2005-05-31 |
| 6899797 | Apparatus for continuous processing of semiconductor wafers | Salman Akram | 2005-05-31 |
| 6897571 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2005-05-24 |
| 6881974 | Probe card for testing microelectronic components | Alan G. Wood, Trung T. Doan | 2005-04-19 |
| 6881274 | Carrier for cleaning sockets for semiconductor components having contact balls | — | 2005-04-19 |
| 6851597 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | Michael E. Hess, John O. Jacobson, Warren M. Farnworth, Alan G. Wood | 2005-02-08 |
| 6850084 | Assembly for testing silicon wafers which have a through-via | — | 2005-02-01 |
| 6841883 | Multi-dice chip scale semiconductor components and wafer level methods of fabrication | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, Kyle K. Kirby +1 more | 2005-01-11 |
| 6841868 | Memory modules including capacity for additional memory | Salman Akram, James M. Wark | 2005-01-11 |
| 6828812 | Test apparatus for testing semiconductor dice including substrate with penetration limiting contacts for making electrical connections | Warren M. Farnworth, Alan G. Wood, Trung T. Doan | 2004-12-07 |
| 6819127 | Method for testing semiconductor components using interposer | — | 2004-11-16 |
| 6806493 | Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching | Salman Akram, Derek Gochnour | 2004-10-19 |
| 6806567 | Chip on board with heat sink attachment and assembly | — | 2004-10-19 |
| 6798224 | Method for testing semiconductor wafers | Warren M. Farnworth, Salman Akram, Alan G. Wood, C. Patrick Doherty, Andrew J. Krivy | 2004-09-28 |
| 6784113 | Chip on board and heat sink attachment methods | — | 2004-08-31 |
| 6774651 | Method for aligning and connecting semiconductor components to substrates | — | 2004-08-10 |
| 6773938 | Probe card, e.g., for testing microelectronic components, and methods for making same | Alan G. Wood, Trung T. Doan | 2004-08-10 |
| 6744346 | Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece | Salman Akram | 2004-06-01 |
| 6735855 | Methods for electrical connector | Salman Akram, Warren M. Farnworth | 2004-05-18 |
| 6730526 | Multi-chip module system and method of fabrication | Salman Akram, James M. Wark | 2004-05-04 |
| 6725536 | Methods for the fabrication of electrical connectors | Salman Akram, Warren M. Farnworth | 2004-04-27 |
| 6720652 | Apparatus providing redundancy for fabricating highly reliable memory modules | Salman Akram, James M. Wark | 2004-04-13 |
| 6710612 | CSP BGA test socket with insert and method | Warren M. Farnworth, Derek Gochnour | 2004-03-23 |
| 6709878 | Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece | Salman Akram | 2004-03-23 |