Issued Patents All Time
Showing 101–125 of 366 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7232754 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Kyle K. Kirby, Salman Akram, Sidney B. Rigg, Warren M. Farnworth, William M. Hiatt | 2007-06-19 |
| 7225044 | Methods for supporting substrates during fabrication of one or more objects thereon by programmable material consolidation techniques | William M. Hiatt, Warren M. Farnworth, Peter Benson | 2007-05-29 |
| 7224051 | Semiconductor component having plate and stacked dice | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, Kyle K. Kirby +1 more | 2007-05-29 |
| 7223626 | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers | Warren M. Farnworth, Alan G. Wood, James M. Wark, Rickie C. Lake | 2007-05-29 |
| 7199439 | Microelectronic imagers and methods of packaging microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Kyle K. Kirby, Peter Benson +4 more | 2007-04-03 |
| 7189954 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more | 2007-03-13 |
| 7166915 | Multi-chip module system | Salman Akram, James M. Wark | 2007-01-23 |
| 7167010 | Pin-in elastomer electrical contactor and methods and processes for making and using the same | — | 2007-01-23 |
| 7155300 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, Michael E. Hess, John O. Jacobson +2 more | 2006-12-26 |
| 7148718 | Articles of manufacture and wafer processing apparatuses | — | 2006-12-12 |
| 7120513 | Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, Michael E. Hess, John O. Jacobson +2 more | 2006-10-10 |
| 7115961 | Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices | Charles M. Watkins, Peter Benson, Salman Akram | 2006-10-03 |
| 7090750 | Plating | Salman Akram | 2006-08-15 |
| 7060526 | Wafer level methods for fabricating multi-dice chip scale semiconductor components | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, Kyle K. Kirby +1 more | 2006-06-13 |
| 7049840 | Hybrid interconnect and system for testing semiconductor dice | Salman Akram, Warren M. Farnworth, Alan G. Wood, James M. Wark, Derek Gochnour | 2006-05-23 |
| 7049700 | Semiconductor test board having laser patterned conductors | Alan G. Wood | 2006-05-23 |
| 7011532 | Spring element for use in an apparatus for attaching to a semiconductor and a method of making | Salman Akram, Derek Gochnour | 2006-03-14 |
| 6998334 | Semiconductor devices with permanent polymer stencil and method for manufacturing the same | Warren M. Farnworth, Alan G. Wood, James M. Wark, Syed Sajid Ahmad, Michael E. Hess +1 more | 2006-02-14 |
| 6998717 | Multi-dice chip scale semiconductor components | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, Kyle K. Kirby +1 more | 2006-02-14 |
| 6967497 | Wafer processing apparatuses and electronic device workpiece processing apparatuses | — | 2005-11-22 |
| 6967307 | Method and process of contact to a heat softened solder ball array | Warren M. Farnworth | 2005-11-22 |
| 6954000 | Semiconductor component with redistribution circuit having conductors and test contacts | Jorge L. de Varona | 2005-10-11 |
| 6939145 | Spring element for use in an apparatus for attaching to a semiconductor and a method of making | Salman Akram, Derek Gochnour | 2005-09-06 |
| 6932077 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus | Salman Akram, Derek Gochnour, Michael E. Hess | 2005-08-23 |
| 6933524 | Semiconductor component having test contacts | Jorge L. de Varona | 2005-08-23 |