Issued Patents All Time
Showing 51–75 of 366 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7786605 | Stacked semiconductor components with through wire interconnects (TWI) | Alan G. Wood | 2010-08-31 |
| 7768096 | System for fabricating semiconductor components with conductive interconnects | Alan G. Wood, William M. Hiatt | 2010-08-03 |
| 7757385 | System for fabricating semiconductor components with through wire interconnects | — | 2010-07-20 |
| 7749349 | Methods and systems for releasably attaching support members to microfeature workpieces | David A. Pratt | 2010-07-06 |
| 7745942 | Die package and probe card structures and fabrication methods | — | 2010-06-29 |
| 7728443 | Semiconductor components with through wire interconnects | — | 2010-06-01 |
| 7727872 | Methods for fabricating semiconductor components with conductive interconnects | Alan G. Wood, William M. Hiatt | 2010-06-01 |
| 7723741 | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers | Warren M. Farnworth, Alan G. Wood, James M. Wark, Rickie C. Lake | 2010-05-25 |
| 7713841 | Methods for thinning semiconductor substrates that employ support structures formed on the substrates | Alan G. Wood, Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Peter Benson +2 more | 2010-05-11 |
| 7709776 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more | 2010-05-04 |
| 7709279 | Methods for testing semiconductor devices methods for protecting the same from electrostatic discharge events during testing, and methods for fabricating inserts for use in testing semiconductor devices | Salman Akram | 2010-05-04 |
| 7705349 | Test inserts and interconnects with electrostatic discharge structures | Salman Akram | 2010-04-27 |
| 7683458 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, James M. Wark, Warren M. Farnworth +6 more | 2010-03-23 |
| 7682962 | Method for fabricating stacked semiconductor components with through wire interconnects | — | 2010-03-23 |
| 7659612 | Semiconductor components having encapsulated through wire interconnects (TWI) | Alan G. Wood | 2010-02-09 |
| 7602618 | Methods and apparatuses for transferring heat from stacked microfeature devices | Salman Akram | 2009-10-13 |
| 7589010 | Semiconductor devices with permanent polymer stencil and method for manufacturing the same | Warren M. Farnworth, Alan G. Wood, James M. Wark, Syed Sajid Ahmad, Michael E. Hess +1 more | 2009-09-15 |
| 7579267 | Methods and systems for fabricating semiconductor components with through wire interconnects (TWI) | Alan G. Wood | 2009-08-25 |
| 7561938 | Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, Michael E. Hess, John O. Jacobson +2 more | 2009-07-14 |
| 7547978 | Underfill and encapsulation of semiconductor assemblies with materials having differing properties | Warren M. Farnworth | 2009-06-16 |
| 7538413 | Semiconductor components having through interconnects | Alan G. Wood, Warren M. Farnworth | 2009-05-26 |
| 7531453 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Kyle K. Kirby, Salman Akram, Sidney B. Rigg, Warren M. Farnworth, William M. Hiatt | 2009-05-12 |
| 7504615 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more | 2009-03-17 |
| 7498675 | Semiconductor component having plate, stacked dice and conductive vias | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, Kyle K. Kirby +1 more | 2009-03-03 |
| 7488899 | Compliant contact pin assembly and card system | Kyle K. Kirby, Warren M. Farnworth, James M. Wark, William M. Hiatt, Alan G. Wood | 2009-02-10 |