Issued Patents All Time
Showing 151–175 of 366 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6703640 | Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching | Salman Akram, Derek Gochnour | 2004-03-09 |
| 6696669 | Circuit and method for heating an adhesive to package or rework a semiconductor die | Salman Akram | 2004-02-24 |
| 6691696 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2004-02-17 |
| 6687990 | Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby | Salman Akram, Derek Gochnour, Michael E. Hess | 2004-02-10 |
| 6687989 | Method for fabricating interconnect having support members for preventing component flexure | Warren M. Farnworth, Mike Hess, James M. Wark, John O. Jacobson, Salman Akram | 2004-02-10 |
| 6670818 | Method for aligning and connecting semiconductor components to substrates | — | 2003-12-30 |
| 6648654 | Electrical connector | Salman Akram, Warren M. Farnworth | 2003-11-18 |
| 6646458 | Apparatus for forming coaxial silicon interconnects | Salman Akram, Alan G. Wood | 2003-11-11 |
| 6642730 | Test carrier with molded interconnect for testing semiconductor components | Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour, John O. Jacobson +2 more | 2003-11-04 |
| 6639416 | Method and apparatus for testing semiconductor dice | Salman Akram, Alan G. Wood, Warren M. Farnworth | 2003-10-28 |
| 6631662 | Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2003-10-14 |
| 6630371 | Chip on board and heat sink attachment methods | — | 2003-10-07 |
| 6630836 | CSP BGA test socket with insert | Warren M. Farnworth, Derek Gochnour | 2003-10-07 |
| 6628128 | CSP BGA test socket with insert and method | Warren M. Farnworth, Derek Gochnour | 2003-09-30 |
| 6620731 | Method for fabricating semiconductor components and interconnects with contacts on opposing sides | Warren M. Farnworth, Alan G. Wood | 2003-09-16 |
| 6620633 | Method for testing bumped semiconductor components | Jorge L. de Varona | 2003-09-16 |
| 6619532 | Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | Michael E. Hess, John O. Jacobson, Warren M. Farnworth, Alan G. Wood | 2003-09-16 |
| 6617687 | Method of forming a test insert for interfacing a device containing contact bumps with a test substrate | Salman Akram | 2003-09-09 |
| 6614003 | Method and process of contact to a heat softened solder ball array | Warren M. Farnworth | 2003-09-02 |
| 6605205 | Method for continuous processing of semiconductor wafers | Salman Akram | 2003-08-12 |
| 6600334 | Force applying probe card and test system for semiconductor wafers | Warren M. Farnworth, James M. Wark | 2003-07-29 |
| 6598290 | Method of making a spring element for use in an apparatus for attaching to a semiconductor | Salman Akram, Derek Gochnour | 2003-07-29 |
| 6596565 | Chip on board and heat sink attachment methods | — | 2003-07-22 |
| 6589594 | Method for filling a wafer through-via with a conductive material | — | 2003-07-08 |
| 6583635 | Semiconductor die test carrier having conductive elastomeric interposer | Alan G. Wood | 2003-06-24 |