Issued Patents All Time
Showing 201–225 of 366 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6422919 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-23 |
| 6423616 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2002-07-23 |
| 6422923 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-23 |
| 6419844 | Method for fabricating calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, Warren M. Farnworth, Salman Akram, James M. Wark, John O. Jacobson | 2002-07-16 |
| 6419550 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-16 |
| 6419143 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | Michael E. Hess, John O. Jacobson, Warren M. Farnworth, Alan G. Wood | 2002-07-16 |
| 6420892 | Calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, Warren M. Farnworth, Salman Akram, James M. Wark, John O. Jacobson | 2002-07-16 |
| 6420681 | Method and process of contact to a heat softened solder ball array | Warren M. Farnworth | 2002-07-16 |
| 6416399 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-09 |
| 6416397 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-09 |
| 6416388 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-09 |
| 6416395 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-09 |
| 6417685 | Test system having alignment member for aligning semiconductor components | Salman Akram, Warren M. Farnworth, Michael E. Hess | 2002-07-09 |
| 6416398 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-09 |
| 6416386 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-09 |
| 6416387 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-09 |
| 6408510 | Method for making chip scale packages | — | 2002-06-25 |
| 6407451 | Micromachined chip scale package | Salman Akram, Warren M. Farnworth | 2002-06-18 |
| 6407570 | Interconnect for testing semiconductor components having support members for preventing component flexure | Warren M. Farnworth, Mike Hess, James M. Wark, John O. Jacobson, Salman Akram | 2002-06-18 |
| 6401580 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2002-06-11 |
| 6400174 | Test system having alignment member for aligning semiconductor components | Salman Akram, Warren M. Farnworth, Michael E. Hess | 2002-06-04 |
| 6397460 | Electrical connector | — | 2002-06-04 |
| 6400169 | Test socket with interposer for testing semiconductor components having contact balls | — | 2002-06-04 |
| 6396292 | Test carrier with decoupling capacitors for testing semiconductor components | Salman Akram | 2002-05-28 |
| 6396291 | Method for testing semiconductor components | Salman Akram, Warren M. Farnworth, Derek Gochnour, Alan G. Wood, John O. Jacobson | 2002-05-28 |