Issued Patents All Time
Showing 251–275 of 366 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6296171 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | Michael E. Hess, John O. Jacobson, Warren M. Farnworth, Alan G. Wood | 2001-10-02 |
| 6297653 | Interconnect and carrier with resistivity measuring contacts for testing semiconductor components | — | 2001-10-02 |
| 6285202 | Test carrier with force applying mechanism guide and terminal contact protector | — | 2001-09-04 |
| 6285203 | Test system having alignment member for aligning semiconductor components | Salman Akram, Warren M. Farnworth, Michael E. Hess | 2001-09-04 |
| 6279563 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2001-08-28 |
| 6277262 | Method and apparatus for continuous processing of semiconductor wafers | Salman Akram | 2001-08-21 |
| 6274390 | Method and apparatus providing redundancy for fabricating highly reliable memory modules | Salman Akram, James M. Wark | 2001-08-14 |
| 6275052 | Probe card and testing method for semiconductor wafers | Warren M. Farnworth, Salman Akram, Alan G. Wood, C. Patrick Doherty, Andrew J. Krivy | 2001-08-14 |
| 6267650 | Apparatus and methods for substantial planarization of solder bumps | — | 2001-07-31 |
| 6263566 | Flexible semiconductor interconnect fabricated by backslide thinning | Derek Gochnour | 2001-07-24 |
| 6255833 | Method for testing semiconductor dice and chip scale packages | Salman Akram, Alan G. Wood, Warren M. Farnworth | 2001-07-03 |
| 6255840 | Semiconductor package with wire bond protective member | Salman Akram, Derek Gochnour, Warren M. Farnworth | 2001-07-03 |
| 6255196 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2001-07-03 |
| 6250192 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2001-06-26 |
| 6246246 | Test head assembly utilizing replaceable silicon contact | — | 2001-06-12 |
| 6246245 | Probe card, test method and test system for semiconductor wafers | Salman Akram, C. Patrick Doherty, Warren M. Farnworth | 2001-06-12 |
| 6242932 | Interposer for semiconductor components having contact balls | — | 2001-06-05 |
| 6242931 | Flexible semiconductor interconnect fabricated by backside thinning | Derek Gochnour | 2001-06-05 |
| 6242103 | Method for producing laminated film/metal structures | Warren M. Farnworth | 2001-06-05 |
| 6239590 | Calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, Warren M. Farnworth, Salman Akram, James M. Wark, John O. Jacobson | 2001-05-29 |
| 6229204 | Chip on board with heat sink attachment | — | 2001-05-08 |
| 6229324 | Test system with mechanical alignment for semiconductor chip scale packages and dice | Salman Akram, Warren M. Farnworth | 2001-05-08 |
| 6229322 | Electronic device workpiece processing apparatus and method of communicating signals within an electronic device workpiece processing apparatus | — | 2001-05-08 |
| 6224713 | Method and apparatus for ultrasonic wet etching of silicon | Salman Akram | 2001-05-01 |
| 6222379 | Conventionally sized temporary package for testing semiconductor dice | Warren M. Farnworth, Alan G. Wood, Salman Akram | 2001-04-24 |