Issued Patents All Time
Showing 226–250 of 366 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6395565 | Multi-chip module system and method of fabrication | Salman Akram, James M. Wark | 2002-05-28 |
| 6392429 | Temporary semiconductor package having dense array external contacts | Warren M. Farnworth, Alan G. Wood, Salman Akram | 2002-05-21 |
| 6392430 | Method of forming coaxial silicon interconnects | Salman Akram, Alan G. Wood | 2002-05-21 |
| 6388458 | Spring element for use in an apparatus for attaching to a semiconductor and a method of making | Salman Akram, Derek Gochnour | 2002-05-14 |
| 6386436 | Method of forming a solder ball | — | 2002-05-14 |
| 6380555 | Bumped semiconductor component having test pads, and method and system for testing bumped semiconductor components | Jorge L. de Varona | 2002-04-30 |
| 6373273 | Test insert containing vias for interfacing a device containing contact bumps with a test substrate | Salman Akram | 2002-04-16 |
| 6369595 | CSP BGA test socket with insert and method | Warren M. Farnworth, Derek Gochnour | 2002-04-09 |
| 6369600 | Test carrier for testing semiconductor components including interconnect with support members for preventing component flexure | Warren M. Farnworth, Mike Hess, James M. Wark, John O. Jacobson, Salman Akram | 2002-04-09 |
| 6365967 | Interconnect structure | Salman Akram | 2002-04-02 |
| 6364196 | Method and apparatus for aligning and attaching balls to a substrate | Alan G. Wood, Salman Akram, Mike Hess | 2002-04-02 |
| 6363295 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, Michael E. Hess, John O. Jacobson +2 more | 2002-03-26 |
| 6362637 | Apparatus for testing semiconductor wafers including base with contact members and terminal contacts | Warren M. Farnworth, Salman Akram, Alan G. Wood, James M. Wark, John O. Jacobson | 2002-03-26 |
| 6358833 | Method of fabricating a micromachined chip scale package | Salman Akram, Warren M. Farnworth | 2002-03-19 |
| 6359456 | Probe card and test system for semiconductor wafers | Warren M. Farnworth, Salman Akram, Alan G. Wood, C. Patrick Doherty, Andrew J. Krivy | 2002-03-19 |
| 6356098 | Probe card, test method and test system for semiconductor wafers | Salman Akram, C. Patrick Doherty, Warren M. Farnworth | 2002-03-12 |
| 6353328 | Test system with mechanical alignment for semiconductor chip scale packages and dice | Salman Akram, Warren M. Farnworth | 2002-03-05 |
| 6353312 | Method for positioning a semiconductor die within a temporary package | Warren M. Farnworth, Jennifer L. Folaron, Robert Folaron, John O. Jacobson, Jay C. Nelson +1 more | 2002-03-05 |
| 6353326 | Test carrier with molded interconnect for testing semiconductor components | Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour, John O. Jacobson +2 more | 2002-03-05 |
| 6340894 | Semiconductor testing apparatus including substrate with contact members and conductive polymer interconnect | Warren M. Farnworth, Alan G. Wood, Trung T. Doan | 2002-01-22 |
| 6339210 | Circuit and method for heating an adhesive to package or rework a semiconductor die | Salman Akram | 2002-01-15 |
| 6329637 | Method and process of contract to a heat softened solder ball array | Warren M. Farnworth | 2001-12-11 |
| 6320397 | Molded plastic carrier for testing semiconductor dice | Alan G. Wood, Warren M. Farnworth | 2001-11-20 |
| 6313651 | Carrier and system for testing bumped semiconductor components | Warren M. Farnworth, Alan G. Wood, Derek Gochnour, Salman Akram | 2001-11-06 |
| 6300782 | System for testing semiconductor components having flexible interconnect | Derek Gochnour | 2001-10-09 |