Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11821714 | Multifunctional composite projectiles and methods of manufacturing the same | Howard D. Kent, Jennifer L. Folaron | 2023-11-21 |
| 11047657 | Long range large caliber frangible round for defending against UAV'S | Joseph Garst, Cory Michalec, Donald O. Bigelow | 2021-06-29 |
| 10843393 | Injection molding apparatus and method of use | Scott Sando | 2020-11-24 |
| 10760885 | Multifunctional composite projectiles and methods of manufacturing the same | Howard D. Kent, Jennifer L. Folaron | 2020-09-01 |
| 10753715 | Long range large caliber frangible round for defending against UAVS | Joseph Garst | 2020-08-25 |
| 10466023 | Long range large caliber frangible round for defending against UAV'S | Joseph Garst | 2019-11-05 |
| 10429146 | Firearm suppression device | Joseph Garst | 2019-10-01 |
| 10107581 | Firearm suppression device | Joseph Garst | 2018-10-23 |
| 7799132 | Patterned atomic layer epitaxy | John N. Randall, Jingping Peng, Jun-Fu Liu, George D. Skidmore, Christof Baur +1 more | 2010-09-21 |
| 7675300 | Charged particle beam device probe operation | Christof Baur, Adam Hartman, Philip C. Foster, Jay C. Nelson, Richard Stallcup | 2010-03-09 |
| 7326293 | Patterned atomic layer epitaxy | John N. Randall, Jingping Peng, Jun-Fu Liu, George D. Skidmore, Christof Baur +1 more | 2008-02-05 |
| 7319336 | Charged particle beam device probe operation | Christof Baur, Adam Hartman, Philip C. Foster, Jay C. Nelson, Richard Stallcup | 2008-01-15 |
| 7227140 | Method, system and device for microscopic examination employing fib-prepared sample grasping element | George D. Skidmore, Matthew D. Ellis, Aaron A. Geisberger, Kenneth Bray, Kimberly Tuck | 2007-06-05 |
| 6900459 | Apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, David R. Hembree, James M. Wark +3 more | 2005-05-31 |
| 6492187 | Method for automatically positioning electronic die within component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, David R. Hembree, James M. Wark +3 more | 2002-12-10 |
| 6353312 | Method for positioning a semiconductor die within a temporary package | Warren M. Farnworth, Jennifer L. Folaron, John O. Jacobson, David R. Hembree, Jay C. Nelson +1 more | 2002-03-05 |
| 6210984 | Method and apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, David R. Hembree, James M. Wark +3 more | 2001-04-03 |
| 6150828 | Method and apparatus for automatically positioning electronic dice with component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, David R. Hembree, James M. Wark +3 more | 2000-11-21 |
| 6064194 | Method and apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, Jennifer L. Folaron, David R. Hembree, John O. Jacobson, Jay C. Nelson +1 more | 2000-05-16 |
| 5955877 | Method and apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, David R. Hembree, James M. Wark +3 more | 1999-09-21 |
| 5894218 | Method and apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, David R. Hembree, James M. Wark +3 more | 1999-04-13 |