Issued Patents All Time
Showing 276–300 of 366 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6218848 | Semiconductor probe card having resistance measuring circuitry and method of fabrication | Salman Akram | 2001-04-17 |
| 6215181 | Method and apparatus providing redundancy for fabricating highly reliable memory modules | Salman Akram, James M. Wark | 2001-04-10 |
| 6215322 | Conventionally sized temporary package for testing semiconductor dice | Warren M. Farnworth, Alan G. Wood, Salman Akram | 2001-04-10 |
| 6210984 | Method and apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, James M. Wark, Jennifer L. Folaron +3 more | 2001-04-03 |
| 6211960 | Method and apparatus for aligning and connecting semiconductor components to substrates | — | 2001-04-03 |
| 6207548 | Method for fabricating a micromachined chip scale package | Salman Akram, Warren M. Farnworth | 2001-03-27 |
| 6208157 | Method for testing semiconductor components | Salman Akram, Warren M. Farnworth, Derek Gochnour, Alan G. Wood, John O. Jacobson | 2001-03-27 |
| 6208156 | Test carrier for packaging semiconductor components having contact balls and calibration carrier for calibrating semiconductor test systems | — | 2001-03-27 |
| 6196096 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2001-03-06 |
| 6189772 | Method of forming a solder ball | — | 2001-02-20 |
| 6181144 | Semiconductor probe card having resistance measuring circuitry and method fabrication | Salman Akram | 2001-01-30 |
| 6175242 | Method for forming coaxial silicon interconnects | Salman Akram, Alan G. Wood | 2001-01-16 |
| 6175241 | Test carrier with decoupling capacitors for testing semiconductor components | Salman Akram | 2001-01-16 |
| 6155247 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2000-12-05 |
| 6150828 | Method and apparatus for automatically positioning electronic dice with component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, James M. Wark, Jennifer L. Folaron +3 more | 2000-11-21 |
| 6132570 | Method and apparatus for continuous processing of semiconductor wafers | Salman Akram | 2000-10-17 |
| 6124634 | Micromachined chip scale package | Salman Akram, Warren M. Farnworth | 2000-09-26 |
| 6124214 | Method and apparatus for ultrasonic wet etching of silicon | Salman Akram | 2000-09-26 |
| 6121576 | Method and process of contact to a heat softened solder ball array | Warren M. Farnworth | 2000-09-19 |
| 6119675 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2000-09-19 |
| 6117797 | Attachment method for heat sinks and devices involving removal of misplaced encapsulant | — | 2000-09-12 |
| 6100175 | Method and apparatus for aligning and attaching balls to a substrate | Alan G. Wood, Salman Akram, Mike Hess | 2000-08-08 |
| 6094058 | Temporary semiconductor package having dense array external contacts | Warren M. Farnworth, Alan G. Wood, Salman Akram | 2000-07-25 |
| 6091252 | Method, apparatus and system for testing bumped semiconductor components | Salman Akram, Warren M. Farnworth, Alan G. Wood | 2000-07-18 |
| 6087676 | Multi-chip module system | Salman Akram, James M. Wark | 2000-07-11 |