Issued Patents All Time
Showing 301–325 of 366 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6083376 | Rotating system for electrochemical treatment of semiconductor wafers | Salman Akram | 2000-07-04 |
| 6078186 | Force applying probe card and test system for semiconductor wafers | Warren M. Farnworth, James M. Wark | 2000-06-20 |
| 6072323 | Temporary package, and method system for testing semiconductor dice having backside electrodes | Salman Akram, Warren M. Farnworth, James M. Wark | 2000-06-06 |
| 6072236 | Micromachined chip scale package | Salman Akram, Warren M. Farnworth | 2000-06-06 |
| 6072321 | Micromachined silicon probe card for semiconductor dice and method of fabrication | Salman Akram, Alan G. Wood | 2000-06-06 |
| 6072326 | System for testing semiconductor components | Salman Akram, Warren M. Farnworth, Derek Gochnour, Alan G. Wood, John O. Jacobson | 2000-06-06 |
| 6064194 | Method and apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, Jennifer L. Folaron, Robert Folaron, John O. Jacobson, Jay C. Nelson +1 more | 2000-05-16 |
| 6064216 | Apparatus for testing semiconductor wafers | Warren M. Farnworth, Salman Akram, Alan G. Wood, James M. Wark, John O. Jacobson | 2000-05-16 |
| 6060894 | Temporary package, method and system for testing semiconductor dice having backside electrodes | Salman Akram, Warren M. Farnworth, James M. Wark | 2000-05-09 |
| 6060891 | Probe card for semiconductor wafers and method and system for testing wafers | Warren M. Farnworth, Salman Akram, Alan G. Wood, C. Patrick Doherty, Andrew J. Krivy | 2000-05-09 |
| 6060339 | Method and apparatus providing redundancy for fabricating highly reliable memory modules | Salman Akram, James M. Wark | 2000-05-09 |
| 6057597 | Semiconductor package with pre-fabricated cover | Warren M. Farnworth, Derek Gochnour, Salman Akram, John O. Jacobson, James M. Wark +1 more | 2000-05-02 |
| 6048750 | Method for aligning and connecting semiconductor components to substrates | — | 2000-04-11 |
| 6045026 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | Michael E. Hess, John O. Jacobson, Warren M. Farnworth, Alan G. Wood | 2000-04-04 |
| 6040702 | Carrier and system for testing bumped semiconductor components | Warren M. Farnworth, Alan G. Wood, Derek Gochnour, Salman Akram | 2000-03-21 |
| 6037667 | Socket assembly for use with solder ball | Salman Akram | 2000-03-14 |
| 6033548 | Rotating system and method for electrodepositing materials on semiconductor wafers | Salman Akram | 2000-03-07 |
| 6028436 | Method for forming coaxial silicon interconnects | Salman Akram, Alan G. Wood | 2000-02-22 |
| 6025731 | Hybrid interconnect and system for testing semiconductor dice | Salman Akram, Warren M. Farnworth, Alan G. Wood, James M. Wark, Derek Gochnour | 2000-02-15 |
| 6025728 | Semiconductor package with wire bond protective member | Salman Akram, Derek Gochnour, Warren M. Farnworth | 2000-02-15 |
| 6022750 | Method for fabricating semiconductor interconnect having test structures for evaluating electrical characteristics of the interconnect | Salman Akram | 2000-02-08 |
| 6018249 | Test system with mechanical alignment for semiconductor chip scale packages and dice | Salman Akram, Warren M. Farnworth | 2000-01-25 |
| 6016060 | Method, apparatus and system for testing bumped semiconductor components | Salman Akram, Warren M. Farnworth, Alan G. Wood | 2000-01-18 |
| 6008538 | Method and apparatus providing redundancy for fabricating highly reliable memory modules | Salman Akram, James M. Wark | 1999-12-28 |
| 6006739 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 1999-12-28 |