Issued Patents All Time
Showing 326–350 of 366 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5959310 | Multi-chip module system | Salman Akram, James M. Wark | 1999-09-28 |
| 5955877 | Method and apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, James M. Wark, Jennifer L. Folaron +3 more | 1999-09-21 |
| 5952840 | Apparatus for testing semiconductor wafers | Warren M. Farnworth, Salman Akram, Alan G. Wood, James M. Wark, John O. Jacobson | 1999-09-14 |
| 5949141 | Laminated film/metal structures | Warren M. Farnworth | 1999-09-07 |
| 5949242 | Method and apparatus for testing unpackaged semiconductor dice | Alan G. Wood, Warren M. Farnworth, Salman Akram | 1999-09-07 |
| 5938956 | Circuit and method for heating an adhesive to package or rework a semiconductor die | Salman Akram | 1999-08-17 |
| 5931685 | Interconnect for making temporary electrical connections with bumped semiconductor components | John O. Jacobson, James M. Wark, Warren M. Farnworth, Salman Akram, Alan G. Wood | 1999-08-03 |
| 5929647 | Method and apparatus for testing semiconductor dice | Salman Akram, Alan G. Wood, Warren M. Farnworth | 1999-07-27 |
| 5915977 | System and interconnect for making temporary electrical connections with bumped semiconductor components | John O. Jacobson, James M. Wark, Warren M. Farnworth, Salman Akram, Alan G. Wood | 1999-06-29 |
| 5907492 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, Michael E. Hess, John O. Jacobson +2 more | 1999-05-25 |
| 5896036 | Carrier for testing semiconductor dice | Alan G. Wood, Warren M. Farnworth | 1999-04-20 |
| 5894218 | Method and apparatus for automatically positioning electronic dice within component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, James M. Wark, Jennifer L. Folaron +3 more | 1999-04-13 |
| 5893966 | Method and apparatus for continuous processing of semiconductor wafers | Salman Akram | 1999-04-13 |
| 5893726 | Semiconductor package with pre-fabricated cover and method of fabrication | Warren M. Farnworth, Derek Gochnour, Salman Akram, John O. Jacobson, James M. Wark +1 more | 1999-04-13 |
| 5878485 | Method for fabricating a carrier for testing unpackaged semiconductor dice | Alan G. Wood, Warren M. Farnworth | 1999-03-09 |
| 5869974 | Micromachined probe card having compliant contact members for testing semiconductor wafers | Salman Akram, Alan G. Wood | 1999-02-09 |
| D402638 | Temporary package for semiconductor dice | Warren M. Farnworth, Alan G. Wood, Salman Akram | 1998-12-15 |
| 5844419 | Method for testing semiconductor packages using decoupling capacitors to reduce noise | Salman Akram, Alan G. Wood | 1998-12-01 |
| D401567 | Temporary package for semiconductor dice | Warren M. Farnworth, Alan G. Wood, Salman Akram | 1998-11-24 |
| 5838161 | Semiconductor interconnect having test structures for evaluating electrical characteristics of the interconnect | Salman Akram | 1998-11-17 |
| 5825195 | Method and apparatus for testing an unpackaged semiconductor die | Warren M. Farnworth, Alan G. Wood | 1998-10-20 |
| 5815000 | Method for testing semiconductor dice with conventionally sized temporary packages | Warren M. Farnworth, Alan G. Wood, Salman Akram | 1998-09-29 |
| 5807762 | Multi-chip module system and method of fabrication | Salman Akram, James M. Wark | 1998-09-15 |
| 5783461 | Temporary semiconductor package having hard-metal, dense-array ball contacts and method of fabrication | — | 1998-07-21 |
| 5776824 | "Method for producing laminated film/metal structures for known good die (""KG"") applications" | Warren M. Farnworth | 1998-07-07 |