Issued Patents All Time
Showing 351–366 of 366 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D394844 | Temporary package for semiconductor dice | Warren M. Farnworth, Alan G. Wood, Salman Akram | 1998-06-02 |
| 5726075 | Method for fabricating microbump interconnect for bare semiconductor dice | Warren M. Farnworth, Derek Gochnour | 1998-03-10 |
| 5607818 | Method for making interconnects and semiconductor structures using electrophoretic photoresist deposition | Salman Akram, Warren M. Farnworth | 1997-03-04 |
| 5578934 | Method and apparatus for testing unpackaged semiconductor dice | Alan G. Wood, Warren M. Farnworth, Salman Akram | 1996-11-26 |
| 5559444 | Method and apparatus for testing unpackaged semiconductor dice | Warren M. Farnworth, Salman Akram | 1996-09-24 |
| 5541525 | Carrier for testing an unpackaged semiconductor die | Alan G. Wood, Warren M. Farnworth | 1996-07-30 |
| 5519332 | Carrier for testing an unpackaged semiconductor die | Alan G. Wood, Warren M. Farnworth | 1996-05-21 |
| 5483174 | Temporary connection of semiconductor die using optical alignment techniques | Warren M. Farnworth | 1996-01-09 |
| 5440240 | Z-axis interconnect for discrete die burn-in for nonpackaged die | Alan G. Wood, Warren M. Farnworth | 1995-08-08 |
| 5424652 | Method and apparatus for testing an unpackaged semiconductor die | Warren M. Farnworth, Alan G. Wood | 1995-06-13 |
| 5408190 | Testing apparatus having substrate interconnect for discrete die burn-in for nonpackaged die | Alan G. Wood, Warren M. Farnworth | 1995-04-18 |
| 5367253 | Clamped carrier for testing of semiconductor dies | Alan G. Wood, Warren M. Farnworth | 1994-11-22 |
| D340702 | Computer programming terminal | — | 1993-10-26 |
| 5249450 | Probehead for ultrasonic forging | Alan G. Wood, Warren M. Farnworth, Larry D. Cromar | 1993-10-05 |
| 5046389 | Universal punch block apparatus | Ted Thompson | 1991-09-10 |
| 5012664 | Progressive form die | — | 1991-05-07 |