Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776877 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2023-10-03 |
| 11594462 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li, Shijian Luo +3 more | 2023-02-28 |
| 11562986 | Stacked semiconductor die assemblies with partitioned logic and associated systems and methods | Jian Li | 2023-01-24 |
| 10978427 | Stacked semiconductor die assemblies with partitioned logic and associated systems and methods | Jian Li | 2021-04-13 |
| 10816275 | Semiconductor device assembly with vapor chamber | Jian Li | 2020-10-27 |
| 10741468 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li, Shijian Luo +3 more | 2020-08-11 |
| 10679921 | Semiconductor device packages with direct electrical connections and related methods | Jian Li, Shijian Luo | 2020-06-09 |
| 10551129 | Semiconductor device assembly with vapor chamber | Jian Li | 2020-02-04 |
| 10215500 | Semiconductor device assembly with vapor chamber | Jian Li | 2019-02-26 |
| 10170389 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li, Shijian Luo +3 more | 2019-01-01 |
| 10163755 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2018-12-25 |
| 10134655 | Semiconductor device packages with direct electrical connections and related methods | Jian Li, Shijian Luo | 2018-11-20 |
| 9899293 | Semiconductor device packages with improved thermal management and related methods | Jian Li, Shijian Luo | 2018-02-20 |
| 9837396 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods | Sameer S. Vadhavkar, Xiao Li, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2017-12-05 |
| 9818625 | Stacked semiconductor die assemblies with thermal spacers and associated systems and methods | Jian Li, Michel Koopmans | 2017-11-14 |
| 9780079 | Semiconductor die assembly and methods of forming thermal paths | Jian Li | 2017-10-03 |
| 9691746 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2017-06-27 |
| 9543274 | Semiconductor device packages with improved thermal management and related methods | Jian Li, Shijian Luo | 2017-01-10 |
| 9443744 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods | Sameer S. Vadhavkar, Xiao Li, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2016-09-13 |
| 9287240 | Stacked semiconductor die assemblies with thermal spacers and associated systems and methods | Jian Li, Michel Koopmans | 2016-03-15 |
| 9184105 | Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages | Jian Li, Shijian Luo | 2015-11-10 |
| 9153520 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li, Shijian Luo +3 more | 2015-10-06 |
| 8816494 | Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages | Jian Li, Shijian Luo | 2014-08-26 |
| 7601562 | Microelectronic component assemblies having lead frames adapted to reduce package bow | Steven R. Smith, Steve Baughman, Bernard F. Ball, Sr., T. Michael O'Connor | 2009-10-13 |
| 7183485 | Microelectronic component assemblies having lead frames adapted to reduce package bow | Steven R. Smith, Steve Baughman, Bernard F. Ball, Sr., T. Michael O'Connor | 2007-02-27 |