XY

Xiaowei Yao

IN Intel: 4 patents #8,473 of 30,777Top 30%
VC Via Alliance Semiconductor Co.: 1 patents #92 of 157Top 60%
Overall (All Time): #983,248 of 4,157,543Top 25%
5
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9892541 Methods for a programmable primitive setup in a 3D graphics pipeline and apparatuses using the same Huaisheng Zhang, Zhou Hong 2018-02-13
7405155 Circuit package and method of plating the same Tam Nguyen, Marc Finot, Rickie C. Lake, Jeffrey A. Bennett, Robert Kohler 2008-07-29
7350987 Optical package fiber pass-through to reduce curvature of optical fiber during threading Marc Finot 2008-04-01
7019394 Circuit package and method of plating the same Tam Nguyen, Marc Finot, Rickie C. Lake, Jeffrey A. Bennett, Robert Kohler 2006-03-28
6821032 Methods of sealing electronic, optical and electro-optical packages and related package and substrate designs Rickie C. Lake, Charles Askew, Marc Epitaux, Marc Finot, Jeffrey A. Bennett +2 more 2004-11-23