Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

US Patent 9570350 · Granted Feb 14, 2017

Estimated economic value: $16,273,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Anisotropic conductive film with carbon-based conductive regions having void spa2025
Three-dimensional stacking semiconductor assemblies and methods of manufacturing2025
Methods and systems for manufacturing semiconductor devices2024
Use of pre-channeled materials for anisotropic conductors2024
Signal delivery in stacked device2024
Anisotropic conductive film with carbon-based conductive regions and related sem2024
Dual sided fan-out package having low warpage across all temperatures2023
Semiconductor device with a protection mechanism and associated systems, devices2023
Solder removal from semiconductor devices2023
Stress tuned stiffeners for micro electronics package warpage control2023
Electronic device with a card-level thermal regulator mechanism and associated s2023
Methods and systems for manufacturing semiconductor devices2022