Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Device module having a plurality of dies electrically connected by posts

Device module having a plurality of dies electrically connected by posts

US Patent 10325874 · Granted Jun 18, 2019

Estimated economic value: $19,717,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multiple, alternating epitaxial silicon2025
Semiconductor devices with flexible reinforcement structure2025
Epitaxial single crystalline silicon growth for memory arrays2025
Memory device interface and method2025
Tunable integrated millimeter wave antenna using laser ablation and/or fuses2025
Memory device interface and method2025
Substrates for semiconductor device assemblies and systems with improved thermal2025
Interposers for microelectronic devices2025
Three-dimensional stacking semiconductor assemblies and methods of manufacturing2025
Stacked interposer structures2025
Semiconductor interconnect structures with conductive elements, and associated s2025
Semiconductor assemblies including vertically integrated circuits and methods of2025