Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8308931 | Method and apparatus for electroplating | Jonathan D. Reid, Bryan L. Buckalew, Zhian He, Seshasayee Varadarajan, Bryan Pennington +4 more | 2012-11-13 |
| 7799684 | Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers | Jonathan D. Reid, Seshasayee Varadarajan, Natalia V. Doubina | 2010-09-21 |
| 7442267 | Anneal of ruthenium seed layer to improve copper plating | Eric G. Webb, Jonathan D. Reid, Johanes H. Sukamto | 2008-10-28 |
| 7405157 | Methods for the electrochemical deposition of copper onto a barrier layer of a work piece | Jon Reid | 2008-07-29 |