Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10358738 | Gap fill process stability monitoring of an electroplating process using a potential-controlled exit step | Quan Ma, Shantinath Ghongadi, Zhian He, Bryan Pennington, Jonathan D. Reid | 2019-07-23 |
| 9685353 | Apparatus and method for edge bevel removal of copper from silicon wafers | Kousik Ganesan, Shantinath Ghongadi, Aaron Louis LaBrie, Steven T. Mayer | 2017-06-20 |
| 9677190 | Membrane design for reducing defects in electroplating systems | Doyeon KIM, Shantinath Ghongadi, Yuichi Takada, Ludan Huang | 2017-06-13 |
| 8419964 | Apparatus and method for edge bevel removal of copper from silicon wafers | Kousik Ganesan, Shanthinath Ghongadi, Aaron Louis LaBrie, Steven T. Mayer | 2013-04-16 |
| 8398831 | Rapidly cleanable electroplating cup seal | Shantinath Ghongadi, Robert Rash, Jeff Hawkins, Seshasayee Varadarajan, Kousik Ganesan +2 more | 2013-03-19 |
| 8377268 | Electroplating cup assembly | Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Jeff Hawkins +2 more | 2013-02-19 |
| 7985325 | Closed contact electroplating cup assembly | Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Jeff Hawkins +2 more | 2011-07-26 |
| 7935231 | Rapidly cleanable electroplating cup assembly | Shantinath Ghongadi, Robert Rash, Jeff Hawkins, Seshasayee Varadarajan, Kousik Ganesan +2 more | 2011-05-03 |
| 6884335 | Electroplating using DC current interruption and variable rotation rate | Eric G. Webb, Jonathan D. Reid, John Sukamto, Sesha Varadarajan, Margolita M. Pollack +1 more | 2005-04-26 |