Issued Patents All Time
Showing 26–50 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10662545 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, Haiying Fu, Thomas A. Ponnuswamy, Hilton Diaz Camilo, Robert Rash +1 more | 2020-05-26 |
| 10655240 | Removing bubbles from plating cells | Stephen J. Banik, II, Gabriel Hay Graham, Alfred Bostick, Sean Wilbur, John Floyd Ostrowski | 2020-05-19 |
| 10648097 | Copper electrodeposition on cobalt lined features | Jeyavel Velmurugan, Thomas A. Ponnuswamy | 2020-05-12 |
| 10612151 | Flow assisted dynamic seal for high-convection, continuous-rotation plating | Aaron Berke, Stephen J. Banik, II, Robert Rash | 2020-04-07 |
| 10364505 | Dynamic modulation of cross flow manifold during elecroplating | Kari Thorkelsson, Aaron Berke, Steven T. Mayer | 2019-07-30 |
| 10301738 | Methods and apparatus for wetting pretreatment for through resist metal plating | Steven T. Mayer, Thomas A. Ponnuswamy, Robert Rash, Brian Paul Blackman, Doug Higley | 2019-05-28 |
| 10233556 | Dynamic modulation of cross flow manifold during electroplating | Gabriel Hay Graham, Jacob L. Hiester, Lee Peng Chua | 2019-03-19 |
| 10211052 | Systems and methods for fabrication of a redistribution layer to avoid etching of the layer | Stephen J. Banik, II, Joseph Richardson, Thomas A. Ponnuswamy | 2019-02-19 |
| 10190232 | Apparatuses and methods for maintaining pH in nickel electroplating baths | Thomas A. Ponnuswamy, Ben Foley, Steven T. Mayer | 2019-01-29 |
| 10190230 | Cross flow manifold for electroplating apparatus | Richard Abraham, Steven T. Mayer, Robert Rash | 2019-01-29 |
| 10128102 | Methods and apparatus for wetting pretreatment for through resist metal plating | Lee Peng Chua, Thomas A. Ponnuswamy, Brian Paul Blackman, Chad Michael Hosack, Steven T. Mayer | 2018-11-13 |
| 10092933 | Methods and apparatuses for cleaning electroplating substrate holders | Santosh Kumar, Steven T. Mayer, Thomas A. Ponnuswamy, Chad Michael Hosack, Robert Rash +2 more | 2018-10-09 |
| 10094034 | Edge flow element for electroplating apparatus | Gabriel Hay Graham, Steven T. Mayer, Robert Rash, James Isaac Fortner, Lee Peng Chua | 2018-10-09 |
| 10017869 | Electroplating apparatus for tailored uniformity profile | Steven T. Mayer, David W. Porter, Robert Rash | 2018-07-10 |
| 10014170 | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity | Burhanuddin Kagajwala, Lee Peng Chua, Aaron Berke, Robert Rash, Steven T. Mayer | 2018-07-03 |
| 9899230 | Apparatus for advanced packaging applications | Steven T. Mayer, David W. Porter, Thomas A. Ponnuswamy | 2018-02-20 |
| 9834852 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, Haiying Fu, Thomas A. Ponnuswamy, Hilton Diaz Camilo, Robert Rash +1 more | 2017-12-05 |
| 9828688 | Methods and apparatus for wetting pretreatment for through resist metal plating | Steven T. Mayer, Thomas A. Ponnuswamy, Robert Rash, Brian Paul Blackman, Doug Higley | 2017-11-28 |
| 9752248 | Methods and apparatuses for dynamically tunable wafer-edge electroplating | Burhanuddin Kagajwala, Aaron Berke, James Isaac Fortner, Robert Rash | 2017-09-05 |
| 9746427 | Detection of plating on wafer holding apparatus | Steven T. Mayer, Haiying Fu, Thomas A. Ponnuswamy | 2017-08-29 |
| 9732434 | Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes | — | 2017-08-15 |
| 9624592 | Cross flow manifold for electroplating apparatus | Richard Abraham, Steven T. Mayer, Robert Rash | 2017-04-18 |
| 9613833 | Methods and apparatus for wetting pretreatment for through resist metal plating | Lee Peng Chua, Thomas A. Ponnuswamy, Brian Paul Blackman, Chad Michael Hosack, Steven T. Mayer | 2017-04-04 |
| 9607822 | Pretreatment method for photoresist wafer processing | Mark L. Rea | 2017-03-28 |
| 9587322 | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath | Manish Ranjan, Shantinath Ghongadi, Frederick Dean Wilmot, Douglas Hill | 2017-03-07 |