Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12392047 | Byproduct removal from electroplating solutions | Joseph Richardson, Jae Shin, Elizabeth Calora, Thomas A. Ponnuswamy, Steven T. Mayer | 2025-08-19 |
| 12305307 | TSV process window and fill performance enhancement by long pulsing and ramping | Jae Shin, Joseph Richardson, Thomas A. Ponnuswamy, Steven T. Mayer | 2025-05-20 |
| 11699590 | Copper electrodeposition sequence for the filling of cobalt lined features | Bryan L. Buckalew, Thomas A. Ponnuswamy | 2023-07-11 |
| 11168407 | Copper electrodeposition on cobalt lined features | Bryan L. Buckalew, Thomas A. Ponnuswamy | 2021-11-09 |
| 10930511 | Copper electrodeposition sequence for the filling of cobalt lined features | Bryan L. Buckalew, Thomas A. Ponnuswamy | 2021-02-23 |
| 10648097 | Copper electrodeposition on cobalt lined features | Bryan L. Buckalew, Thomas A. Ponnuswamy | 2020-05-12 |