Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230495 | Method of depositing silicon nitride films | Shane Tang, Vikrant Rai, Andrew John McKerrow, Huatan Qiu | 2025-02-18 |
| 11832533 | Conformal damage-free encapsulation of chalcogenide materials | Andrew John McKerrow, Meihua Shen, Thorsten Lill, Shane Tang, Kathryn M. Kelchner +4 more | 2023-11-28 |
| 11239420 | Conformal damage-free encapsulation of chalcogenide materials | Andrew John McKerrow, Meihua Shen, Thorsten Lill, Shane Tang, Kathryn M. Kelchner +4 more | 2022-02-01 |
| 11075127 | Suppressing interfacial reactions by varying the wafer temperature throughout deposition | Seshasayee Varadarajan, Aaron R. Fellis, Andrew John McKerrow, Ramesh Chandrasekharan, Jon Henri | 2021-07-27 |
| 10347547 | Suppressing interfacial reactions by varying the wafer temperature throughout deposition | Seshasayee Varadarajan, Aaron R. Fellis, Andrew John McKerrow, Ramesh Chandrasekharan, Jon Henri | 2019-07-09 |
| 10020188 | Method for depositing ALD films using halide-based precursors | Jon Henri, Ramesh Chandrasekharan, Andrew John McKerrow, Seshasayee Varadarajan, Kathryn M. Kelchner | 2018-07-10 |
| 9865455 | Nitride film formed by plasma-enhanced and thermal atomic layer deposition process | Kathryn M. Kelchner | 2018-01-09 |
| 9824884 | Method for depositing metals free ald silicon nitride films using halide-based precursors | Jon Henri, Ramesh Chandrasekharan, Andrew John McKerrow, Seshasayee Varadarajan, Kathryn M. Kelchner | 2017-11-21 |
| 9659769 | Tensile dielectric films using UV curing | Bhadri N. Varadarajan, Sean Chang, Guangquan Lu, David Mordo, Kevin J. Ilcisin +2 more | 2017-05-23 |
| 9598770 | Contoured showerhead for improved plasma shaping and control | Karl Leeser | 2017-03-21 |
| 9589790 | Method of depositing ammonia free and chlorine free conformal silicon nitride film | Jon Henri, Dennis M. Hausmann, Shane Tang | 2017-03-07 |
| 9315899 | Contoured showerhead for improved plasma shaping and control | Karl Leeser | 2016-04-19 |
| 9214333 | Methods and apparatuses for uniform reduction of the in-feature wet etch rate of a silicon nitride film formed by ALD | Kathryn M. Kelchner, Jon Henri, Dennis M. Hausmann | 2015-12-15 |
| 9076646 | Plasma enhanced atomic layer deposition with pulsed plasma exposure | Jon Henri, Kathryn M. Kelchner, Sathish Babu S. V. Janjam, Shane Tang | 2015-07-07 |
| 8512818 | Cascaded cure approach to fabricate highly tensile silicon nitride films | Bhadri N. Varadarajan, Gengwei Jiang, Sirish Reddy | 2013-08-20 |
| 8362571 | High compressive stress carbon liners for MOS devices | Qingguo Wu, Mandyam Sriram, Seshasayee Varadarajan, Haiying Fu, Pramod Subramonium +2 more | 2013-01-29 |
| 8211510 | Cascaded cure approach to fabricate highly tensile silicon nitride films | Bhadri N. Varadarajan, Gengwei Jiang, Sirish Reddy | 2012-07-03 |
| 7998881 | Method for making high stress boron-doped carbon films | Qingguo Wu, Mandyam Sriram, Seshasayee Varadarajan, Akhil Singhal | 2011-08-16 |
| 7906817 | High compressive stress carbon liners for MOS devices | Qingguo Wu, Mandyam Sriram, Seshasayee Varadarajan, Haiying Fu, Pramod Subramonium +2 more | 2011-03-15 |
| 7745346 | Method for improving process control and film conformality of PECVD film | Dennis M. Hausmann, Andrew Antonelli, Sesha Varadarajan, Bart Van Schravendijk | 2010-06-29 |
| 7327001 | PMOS transistor with compressive dielectric capping layer | Akhil Singhal, Bhadri N. Varadarajan | 2008-02-05 |
| 7214630 | PMOS transistor with compressive dielectric capping layer | Bhadri N. Varadarajan, Akhil Singhal | 2007-05-08 |
| 7041543 | Strained transistor architecture and method | Bhadri N. Varadarajan, William Crew | 2006-05-09 |