| 12381106 |
Systems and methods of seasoning electrostatic chucks with dielectric seasoning films |
Allison Yau, Zeqiong Zhao, Sang Jin Kim, Zhijun Jiang, Deenesh Padhi +1 more |
2025-08-05 |
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| 12371781 |
In situ protective coating of chamber components for semiconductor processing |
David Charles Smith, Karl Leeser |
2025-07-29 |
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| 12372872 |
Extreme ultraviolet (EUV) lithography using an intervening layer or a multi-layer stack with varying mean free paths for secondary electron generation |
Andrew Xiao Liang, Nader Shamma, Rich Wise, Arpan Mahorowala, Gregory Blachut +1 more |
2025-07-29 |
|
| 12315724 |
Helium-free silicon formation |
Zeqiong Zhao, Allison Yau, Sang Jin Kim, Zhijun Jiang, Deenesh Padhi +1 more |
2025-05-27 |
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| 12248252 |
Bubble defect reduction |
Bart J. van Schravendijk, Girish Dixit, David Charles Smith, Siva Kanakasabapathy |
2025-03-11 |
|
| 12211908 |
Profile shaping for control gate recesses |
Allison Yau, Sang Jin Kim, Zeqiong Zhao, Zhijun Jiang, Deenesh Padhi +1 more |
2025-01-28 |
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| 11915923 |
Method to clean SnO2 film from chamber |
Dustin Zachary Austin, Jeongseok Ha, Pei-Chi Liu |
2024-02-27 |
$293,347,000 |
| 11887846 |
Deposition tool and method for depositing metal oxide films on organic materials |
Patrick A. Van Cleemput |
2024-01-30 |
$261,554,000 |
| 11784229 |
Profile shaping for control gate recesses |
Allison Yau, Sang Jin Kim, Zeqiong Zhao, Zhijun Jiang, Deenesh Padhi +1 more |
2023-10-10 |
$39,034,000 |
| 11717866 |
Etching metal-oxide and protecting chamber components |
Dustin Zachary Austin, Alon Ganany, Daniel Boatright |
2023-08-08 |
$393,474,000 |
| 11670516 |
Metal-containing passivation for high aspect ratio etch |
Karthik S. Colinjivadi, Samantha Tan, Shih-Ked Lee, George Matamis, Yongsik Yu +4 more |
2023-06-06 |
$175,488,000 |
| 11646216 |
Systems and methods of seasoning electrostatic chucks with dielectric seasoning films |
Allison Yau, Zeqiong Zhao, Sang Jin Kim, Zhijun Jiang, Deenesh Padhi +1 more |
2023-05-09 |
$42,400,000 |
| 11031244 |
Modification of SNO2 surface for EUV lithography |
Nader Shamma, Dustin Zachary Austin |
2021-06-08 |
$197,833,000 |
| 10957514 |
Apparatus and method for deposition and etch in gap fill |
Patrick A. Van Cleemput, Martin E. Freeborn, Bart J. van Schravendijk |
2021-03-23 |
$164,801,000 |
| 10840082 |
Method to clean SnO2 film from chamber |
Dustin Zachary Austin, Jeongseok Ha, Pei-Chi Liu |
2020-11-17 |
$203,446,000 |
| 10763107 |
Methods of encapsulation |
Bart J. van Schravendijk, Joseph Hung-chi Wei, Bhadri N. Varadarajan, Kevin McLaughlin, Casey Holder +1 more |
2020-09-01 |
$45,225,000 |
| 10566186 |
Methods of encapsulation |
Bart J. van Schravendijk, Joseph Hung-chi Wei, Bhadri N. Varadarajan, Kevin McLaughlin, Casey Holder +1 more |
2020-02-18 |
$39,150,000 |
| 10373806 |
Apparatus and method for deposition and etch in gap fill |
Patrick A. Van Cleemput, Martin E. Freeborn, Bart J. van Schravendijk |
2019-08-06 |
$34,626,000 |
| 10157736 |
Methods of encapsulation |
Bart J. van Schravendijk, Joseph Hung-chi Wei, Bhadri N. Varadarajan, Kevin McLaughlin, Casey Holder +1 more |
2018-12-18 |
$29,777,000 |
| 10081869 |
Defect control in RF plasma substrate processing systems using DC bias voltage during movement of substrates |
Edward Augustyniak, Christopher Ramsayer, Kareem Boumatar |
2018-09-25 |
$87,167,000 |
| 9773643 |
Apparatus and method for deposition and etch in gap fill |
Patrick A. Van Cleemput, Martin E. Freeborn, Bart J. van Schravendijk |
2017-09-26 |
$58,058,000 |
| 9617637 |
Systems and methods for improving deposition rate uniformity and reducing defects in substrate processing systems |
Arul N. Dhas, Brannon Kelley, Jaswinder Guiliani |
2017-04-11 |
$9,143,000 |
| 9328416 |
Method for the reduction of defectivity in vapor deposited films |
Arul N. Dhas, Ming Li, Kareem Boumatar |
2016-05-03 |
$20,231,000 |
| 7998881 |
Method for making high stress boron-doped carbon films |
Qingguo Wu, James S. Sims, Mandyam Sriram, Seshasayee Varadarajan |
2011-08-16 |
$14,393,000 |
| 7327001 |
PMOS transistor with compressive dielectric capping layer |
James S. Sims, Bhadri N. Varadarajan |
2008-02-05 |
$5,570,000 |
