Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12249514 | Carbon based depositions used for critical dimension control during high aspect ratio feature etches and for forming protective layers | Jon Henri, Francis Sloan Roberts, Kapu Sirish Reddy, Samantha Tan, Shih-Ked Lee +4 more | 2025-03-11 |
| 11670516 | Metal-containing passivation for high aspect ratio etch | Samantha Tan, Shih-Ked Lee, George Matamis, Yongsik Yu, Yang Pan +4 more | 2023-06-06 |
| 11062897 | Metal doped carbon based hard mask removal in semiconductor fabrication | Yongsik Yu, David Cheung, Kirk Ostrowski, Nikkon Ghosh, Samantha Tan +2 more | 2021-07-13 |
| 8431033 | High density plasma etchback process for advanced metallization applications | Chunming Zhou, Liqi Wu, Emery Kuo, Huatan Qiu, KieJin Park | 2013-04-30 |