Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12351909 | Gap fill methods using catalyzed deposition | Byunghoon Yoon, Joung Joo Lee, Kai Wu, Xi Cen, Wei-Sheng Lei +2 more | 2025-07-08 |
| 12291779 | Methods of selective atomic layer deposition | Bhaskar Jyoti Bhuyan, Mark Saly, David Thompson, Tobin Kaufman-Osborn, Kurt Fredrickson +1 more | 2025-05-06 |
| 12272551 | Selective metal removal with flowable polymer | Feng Q. Liu, Bhaskar Jyoti Bhuyan, James Hugh Connolly, Zhimin QI, Jie Zhang +7 more | 2025-04-08 |
| 12094785 | Dual silicide process using ruthenium silicide | Thomas Anthony Empante, Avgerinos V. Gelatos, Zhibo Yuan, Joung Joo Lee, Byunghoon Yoon | 2024-09-17 |
| 12024770 | Methods for selective deposition using self-assembled monolayers | Chang Ke, Wenyu Zhang | 2024-07-02 |
| 11821085 | Methods of selective atomic layer deposition | Bhaskar Jyoti Bhuyan, Mark Saly, David Thompson, Tobin Kaufman-Osborn, Kurt Fredrickson +1 more | 2023-11-21 |
| 11735420 | Wafer treatment for achieving defect-free self-assembled monolayers | Chang Ke, Lei Zhou, Biao Liu, Cheng Pan, Yuanhong Guo +5 more | 2023-08-22 |
| 11515155 | Methods for enhancing selectivity in SAM-based selective deposition | Chang Ke, Michael S. Jackson, Lei Zhou, Shuyi Zhang, David Thompson +3 more | 2022-11-29 |
| 11450525 | Selective aluminum oxide film deposition | Hung T. Nguyen, Bhaskar Jyoti Bhuyan, Mark Saly, Feng Q. Liu, David Thompson | 2022-09-20 |
| 11421318 | Methods and apparatus for high reflectivity aluminum layers | Jacqueline S. Wrench, Hsiang-Ning Wu, Paul F. Ma, Sang Ho Yu, Fuqun Grace Vasiknanonte +1 more | 2022-08-23 |
| 11075276 | Methods and apparatus for n-type metal oxide semiconductor (NMOS) metal gate materials using atomic layer deposition (ALD) processes with metal based precursors | Yongjing Lin, Shih Chung Chen, Naomi Yoshida, Lin Dong, Rongjun Wang +5 more | 2021-07-27 |
| 11033930 | Methods and apparatus for cryogenic gas stream assisted SAM-based selective deposition | Chang Ke, Song-Moon Suh, Michael S. Jackson, Lei Zhou, Biao Liu +3 more | 2021-06-15 |
| 10957590 | Method for forming a layer | Wenhui Wang, Huixiong Dai, Christopher S. Ngai, Wenyu Zhang, Yongmei Chen +3 more | 2021-03-23 |
| 10950433 | Methods for enhancing selectivity in SAM-based selective deposition | Chang Ke, Michael S. Jackson, Lei Zhou, Shuyi Zhang, David Thompson +3 more | 2021-03-16 |
| 10770292 | Wafer treatment for achieving defect-free self-assembled monolayers | Chang Ke, Lei Zhou, Biao Liu, Cheng Pan, Yuanhong Guo +5 more | 2020-09-08 |
| 10643840 | Selective deposition defects removal by chemical etch | Jeffrey W. Anthis, Chang Ke, Pratham Jain, Benjamin Schmiege, Guoqiang Jian +3 more | 2020-05-05 |
| 10608097 | Low thickness dependent work-function nMOS integration for metal gate | Paul F. Ma, Seshadri Ganguli, Shih Chung Chen, Rajesh Sathiyanarayanan, Atashi Basu +3 more | 2020-03-31 |
| 10014185 | Selective etch of metal nitride films | Wenyu Zhang, Shih Chung Chen, Wei V. Tang, Leung Kway Lee, Xinming Zhang +1 more | 2018-07-03 |
| 9748354 | Multi-threshold voltage structures with a lanthanum nitride film and methods of formation thereof | Wei V. Tang, Paul F. Ma, Steven C. H. Hung, Michael P. Chudzik, Siddarth A. Krishnan +6 more | 2017-08-29 |
| 9653352 | Methods for forming metal organic tungsten for middle of the line (MOL) applications | Sang Ho Yu, Kazuya Daito, Kie Jin Park, Kai Wu, David Thompson | 2017-05-16 |
| 9194045 | Continuous plasma and RF bias to regulate damage in a substrate processing system | Huatan Qiu, Yung-Yi Lee | 2015-11-24 |
| 8431033 | High density plasma etchback process for advanced metallization applications | Chunming Zhou, Karthik S. Colinjivadi, Emery Kuo, Huatan Qiu, KieJin Park | 2013-04-30 |