Issued Patents All Time
Showing 25 most recent of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388049 | High connectivity device stacking | Kurtis Leschkies, Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho +1 more | 2025-08-12 |
| 12374678 | Lithium metal surface modification using carbonate passivation | Alejandro Sevilla, Girishkumar Gopalakrishnannair, Ezhiylmurugan RANGASAMY, David Masayuki Ishikawa, Subramanya P. HERLE | 2025-07-29 |
| 12358073 | Method and apparatus for laser drilling blind vias | Kurtis Leschkies, Roman Gouk, Steven Verhaverbeke, Visweswaren Sivaramakrishnan | 2025-07-15 |
| 12351909 | Gap fill methods using catalyzed deposition | Byunghoon Yoon, Liqi Wu, Joung Joo Lee, Kai Wu, Xi Cen +2 more | 2025-07-08 |
| 12191198 | Low resistivity tungsten film and method of manufacture | Feihu Wang, Joung Joo Lee, Xi Cen, Zhibo Yuan, Kai Wu +2 more | 2025-01-07 |
| 12131952 | Wafer dicing using femtosecond-based laser and plasma etch | Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2024-10-29 |
| 12112890 | Top magnets for decreased non-uniformity in PVD | Borui Xia, Anthony Chih-Tung Chan, Shiyu YUE, Aravind Kamath, Mukund Sundararajan +2 more | 2024-10-08 |
| 12091349 | Laser dicing glass wafers using advanced laser sources | Mahendran Chidambaram, Kangkang Wang, Ludovic Godet, Visweswaren Sivaramakrishnan | 2024-09-17 |
| 11964343 | Laser dicing system for filamenting and singulating optical devices | Mahendran Chidambaram, Shmuel Erez, John Rusconi | 2024-04-23 |
| 11854888 | Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach | Jungrae Park, Zavier Zai Yeong Tan, Karthik Balakrishnan, James S. Papanu | 2023-12-26 |
| 11742330 | High connectivity device stacking | Kurtis Leschkies, Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho +1 more | 2023-08-29 |
| 11705365 | Methods of micro-via formation for advanced packaging | Kurtis Leschkies, Roman Gouk, Giback Park, Kyuil Cho, Tapash Chakraborty +2 more | 2023-07-18 |
| 11676832 | Laser ablation system for package fabrication | Kurtis Leschkies, Jeffrey L. Franklin, Steven Verhaverbeke, Jean Delmas, Han-Wen Chen +1 more | 2023-06-13 |
| 11621194 | Wafer dicing using femtosecond-based laser and plasma etch | Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2023-04-04 |
| 11518100 | Additive manufacturing with a polygon scanner | Mahendran Chidambaram, Visweswaren Sivaramakrishnan, Kashif Maqsood | 2022-12-06 |
| 11400545 | Laser ablation for package fabrication | Kurtis Leschkies, Jeffrey L. Franklin, Jean Delmas, Han-Wen Chen, Giback Park +1 more | 2022-08-02 |
| 11355394 | Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate breakthrough treatment | Brad Eaton, Ajay Kumar | 2022-06-07 |
| 11286556 | Selective deposition of titanium films | Byunghoon Yoon, Sang Ho Yu | 2022-03-29 |
| 11257790 | High connectivity device stacking | Kurtis Leschkies, Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho +1 more | 2022-02-22 |
| 11232951 | Method and apparatus for laser drilling blind vias | Kurtis Leschkies, Roman Gouk, Steven Verhaverbeke, Visweswaren Sivaramakrishnan | 2022-01-25 |
| 11217536 | Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process | Jungrae Park, Brad Eaton, James S. Papanu, Ajay Kumar | 2022-01-04 |
| 11158540 | Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process | Wenguang Li, James S. Papanu, Prabhat Kumar, Brad Eaton, Ajay Kumar +1 more | 2021-10-26 |
| 10910271 | Wafer dicing using femtosecond-based laser and plasma etch | Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2021-02-02 |
| 10714390 | Wafer dicing using femtosecond-based laser and plasma etch | Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2020-07-14 |
| 10661383 | Mitigation of particle contamination for wafer dicing processes | Jungrae Park, Ajay Kumar, Brad Eaton | 2020-05-26 |