Issued Patents All Time
Showing 25 most recent of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388049 | High connectivity device stacking | Kurtis Leschkies, Han-Wen Chen, Giback Park, Kyuil Cho, Jeffrey L. Franklin +1 more | 2025-08-12 |
| 12374611 | Package core assembly and fabrication methods | Han-Wen Chen, Giback Park, Kyuil Cho, Kurtis Leschkies, Roman Gouk +4 more | 2025-07-29 |
| 12358073 | Method and apparatus for laser drilling blind vias | Wei-Sheng Lei, Kurtis Leschkies, Roman Gouk, Visweswaren Sivaramakrishnan | 2025-07-15 |
| 12354968 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Guan Huei See, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2025-07-08 |
| 12087679 | Package core assembly and fabrication methods | Han-Wen Chen, Giback Park, Kyuil Cho, Kurtis Leschkies, Roman Gouk +4 more | 2024-09-10 |
| 11931855 | Planarization methods for packaging substrates | Han-Wen Chen, Tapash Chakraborty, Prayudi Lianto, Prerna Goradia, Giback Park +3 more | 2024-03-19 |
| 11927885 | Fluoropolymer stamp fabrication method | Roman Gouk, Jean Delmas, Chintan Buch | 2024-03-12 |
| 11887934 | Package structure and fabrication methods | Han-Wen Chen, Giback Park, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more | 2024-01-30 |
| 11881447 | Package core assembly and fabrication methods | Han-Wen Chen, Giback Park, Kyuil Cho, Kurtis Leschkies, Roman Gouk +4 more | 2024-01-23 |
| 11862546 | Package core assembly and fabrication methods | Han-Wen Chen, Giback Park, Kyuil Cho, Kurtis Leschkies, Roman Gouk +2 more | 2024-01-02 |
| 11837680 | Substrate structuring methods | Han-Wen Chen, Giback Park | 2023-12-05 |
| 11798903 | Methods of forming microvias with reduced diameter | Chintan Buch, Roman Gouk | 2023-10-24 |
| 11742330 | High connectivity device stacking | Kurtis Leschkies, Han-Wen Chen, Giback Park, Kyuil Cho, Jeffrey L. Franklin +1 more | 2023-08-29 |
| 11715700 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Guan Huei See, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2023-08-01 |
| 11705365 | Methods of micro-via formation for advanced packaging | Wei-Sheng Lei, Kurtis Leschkies, Roman Gouk, Giback Park, Kyuil Cho +2 more | 2023-07-18 |
| 11694912 | High pressure and high temperature anneal chamber | Jean Delmas, Kurtis Leschkies | 2023-07-04 |
| 11676832 | Laser ablation system for package fabrication | Kurtis Leschkies, Jeffrey L. Franklin, Wei-Sheng Lei, Jean Delmas, Han-Wen Chen +1 more | 2023-06-13 |
| 11566322 | Shadow mask with plasma resistant coating | Xi Huang, Fei Peng, Kiran Krishnapur, Ruiping Wang, Jrjyan Jerry CHEN +1 more | 2023-01-31 |
| 11521937 | Package structures with built-in EMI shielding | Han-Wen Chen, Giback Park, Chintan Buch | 2022-12-06 |
| 11521935 | Package structure and fabrication methods | Han-Wen Chen, Giback Park, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more | 2022-12-06 |
| 11476202 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Guan Huei See, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2022-10-18 |
| 11469113 | High pressure and high temperature anneal chamber | Jean Delmas, Kurtis Leschkies | 2022-10-11 |
| 11462417 | High pressure and high temperature anneal chamber | Jean Delmas, Kurtis Leschkies | 2022-10-04 |
| 11454884 | Fluoropolymer stamp fabrication method | Roman Gouk, Jean Delmas, Chintan Buch | 2022-09-27 |
| 11424137 | Drying process for high aspect ratio features | Roman Gouk, Han-Wen Chen, Jean Delmas | 2022-08-23 |